5SGXMA5N1F45C2N

The 5SGXMA5N1F45C2N is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel, delivered in a 1932-BBGA FCBGA package for surface-mount assembly. This commercial-grade device provides high programmable logic density and substantial on-chip memory to support complex digital designs.

With a core supply range of 870 mV to 930 mV, up to 840 I/Os, and series-level transceiver capability documented for Stratix V GX devices, the part is suited to applications that need large-scale logic, abundant I/O, and significant embedded RAM within a compact FCBGA footprint.

Key Features

• Logic Density  Approximately 490,000 logic elements, enabling implementation of large, complex logic designs and system integration on a single device.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM, providing substantial block RAM resources for buffering, on-chip data storage, and state machines.
• I/O Capacity  Up to 840 user I/Os to support wide parallel interfaces, multiple high-pin-count peripherals, and complex board-level connectivity.
• Transceiver Capability (Series Information)  Stratix V GX series documentation specifies GX transceiver speed grades up to 14.1 Gbps, reflecting the family’s support for high-speed serial links (series-level information from the device datasheet).
• Power and Voltage  Core supply voltage specified from 870 mV to 930 mV for the device core.
• Package & Mounting  1932-BBGA (FCBGA) package, supplier device package noted as 1932-FBGA, FC (45×45); surface-mount mounting type simplifies high-density PCB assembly.
• Commercial Grade Operating Range  Rated for commercial temperature operation from 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-speed serial communication systems  Leverages the Stratix V GX family’s documented transceiver speed grades and large logic fabric to implement protocol handling and SERDES-based links.
• Network and telecom processing  High logic density and abundant I/O make the device suitable for packet processing, switching logic, and interface bridging within commercial networking equipment.
• Data-path acceleration and processing  Large embedded RAM and logic resources support data buffering, pipeline processing, and custom accelerator functions.
• Test, measurement, and imaging  Wide I/O count and on-chip memory enable capture, preprocessing, and control tasks in instrumentation and imaging systems.

Unique Advantages

• High integration density: Combines approximately 490,000 logic elements with about 46 Mbits of embedded memory to consolidate complex systems into a single FPGA.
• Extensive I/O support: Up to 840 I/Os provide flexibility for parallel interfaces, multiple peripherals, and complex board-level routing.
• Family-level high-speed serial capability: Stratix V GX series documentation includes transceiver speed grades that support multi-gigabit links, enabling high-throughput serial communication designs.
• Compact FCBGA package: The 1932-BBGA (1932-FBGA, 45×45) package delivers high pin count in a compact surface-mount form factor for dense PCB implementations.
• Commercial temperature support: Rated 0 °C to 85 °C for deployments in commercial environments where that operating range is required.
• RoHS compliant: Meets environmental compliance requirements for lead-free assembly and regulatory conformance.

Why Choose 5SGXMA5N1F45C2N?

The 5SGXMA5N1F45C2N delivers substantial programmable logic, on-chip memory, and large I/O capacity in a high-pin-count FCBGA package, making it a strong option for commercial designs that require consolidation of complex digital functions and high-bandwidth interfaces. As a member of the Stratix V GX family, its series-level capabilities for high-speed serial transceivers further extend its applicability to communication-focused solutions.

This device is well suited to designers and system architects building commercial networking, data-path acceleration, instrumentation, and other high-density FPGA applications who need a balance of logic capacity, embedded RAM, and extensive I/O in a surface-mount package.

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