5SGXMA5N1F45C1WN

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA

Quantity 108 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5N1F45C1WN – Stratix® V GX FPGA; 490,000 logic elements, ~46 Mbits RAM, 840 I/Os, 1932-BBGA (FCBGA)

The 5SGXMA5N1F45C1WN is a Stratix® V GX field-programmable gate array (FPGA) from Intel, built for high-density, high-I/O designs. This commercial-grade device combines large logic capacity, substantial on-chip RAM, and a high pin count in a 1932-ball FCBGA package for surface-mount assembly.

Targeted at designs that demand extensive programmable logic and abundant I/O, the device delivers a platform for complex digital systems where integration and board-level consolidation are priorities.

Key Features

  • Core / Logic Density — 490,000 logic elements and 185,000 logic blocks provide substantial programmable fabric for complex designs and large-scale integration.
  • Embedded Memory — Approximately 46 Mbits of on-chip RAM to support buffering, on-chip data storage, and memory-intensive functions without immediate reliance on external memory.
  • I/O Capacity — 840 general-purpose I/O pins to accommodate dense connectivity and multiple high-pin-count interfaces.
  • Package & Mounting — 1932-BBGA (FCBGA), supplier package listed as 1932-FBGA, FC (45×45); surface-mount device suitable for standard PCB assembly processes.
  • Power — Core supply voltage range of 870 mV to 930 mV, allowing designers to plan precise power delivery for the FPGA core.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for commercial-environment applications.
  • Compliance — RoHS-compliant component to meet common environmental and assembly requirements.
  • Series Transceiver Options (series-level) — The Stratix V GX family includes GX transceiver speed grades documented in the device series datasheet (series-level options include GX channel speed grades such as up to 14.1 Gbps; consult series documentation for specific transceiver speed-grade availability).

Typical Applications

  • High-density FPGA designs — Architectures requiring large logic count and embedded RAM for complex custom accelerators and protocol processing.
  • High-pin-count interface consolidation — Systems that need to aggregate multiple interfaces and peripherals using the device’s extensive I/O.
  • Embedded compute and buffering — Designs where on-chip RAM and logic are used to implement packet buffering, streaming datapaths, or large state machines.

Unique Advantages

  • Substantial on-chip resources: The combination of 490,000 logic elements and approximately 46 Mbits of embedded RAM reduces the need for external logic and memory components.
  • High I/O count: 840 I/O pins enable direct connection to many peripherals and high-density board layouts, simplifying system partitioning.
  • Compact, manufacturable package: 1932-ball FCBGA (45×45) in a surface-mount form factor supports modern PCB assembly processes while preserving a high-pin-count footprint.
  • Commercial temperature rating: Designed for 0 °C to 85 °C operation to meet typical commercial application environment requirements.
  • RoHS compliance: Compliant with RoHS to support standard environmental and assembly workflows.
  • Series-level transceiver flexibility: As part of the Stratix V GX family, series documentation describes multiple transceiver speed-grade options for designs that may require high-speed serial links (refer to series documentation for specifics).

Why Choose 5SGXMA5N1F45C1WN?

The 5SGXMA5N1F45C1WN positions itself as a high-density, high-connectivity FPGA option within the Stratix V GX family. With nearly half a million logic elements, substantial embedded RAM, and an 840-pin I/O footprint in a 1932-ball FCBGA package, it is well suited for engineering teams looking to consolidate complex logic, large buffers, and numerous interfaces into a single programmable device while maintaining a commercial temperature profile.

Choosing this device provides designers with a scalable FPGA fabric backed by Intel’s Stratix V family documentation and datasheet-defined operating parameters, enabling planning for power delivery, thermal envelope, and board-level integration.

Request a quote or submit a pricing inquiry to review availability, lead times, and volume options for 5SGXMA5N1F45C1WN.

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