5SGXMA5N1F45C1N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA

Quantity 21 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5N1F45C1N – Stratix® V GX FPGA, 490,000 logic elements, 840 I/Os

The 5SGXMA5N1F45C1N is a Stratix® V GX field programmable gate array (FPGA) device from Intel, delivered in a 1932-ball FCBGA package. Designed for high-density programmable logic applications, this commercial-grade FPGA combines a large logic fabric with substantial on-chip RAM and an extensive I/O count to support complex system integration.

Key capabilities exposed by the device’s specifications — including approximately 46 Mbits of embedded memory, 490,000 logic elements, and 840 user I/Os — make it suitable for designs that require dense logic, sizable local memory, and broad peripheral connectivity within a surface-mount 45×45 mm package footprint.

Key Features

  • Logic Capacity  Approximately 490,000 logic elements for implementing large-scale digital designs and complex custom logic functions.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory for many functions.
  • I/O Density  840 user I/Os to accommodate high-channel-count interfaces, parallel buses, and multi-peripheral connections.
  • Power Supply  Core voltage supply range specified from 870 mV to 930 mV for defined operating conditions.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial applications.
  • Package & Mounting  1932-ball FCBGA (45×45 mm) surface-mount package (supplier device package: 1932-FBGA, FC) for high-pin-density board designs.
  • Standards Compliance  RoHS compliant to support regulatory environmental requirements.

Typical Applications

  • High-density digital processing  Use the large logic element count to implement complex signal processing, protocol handling, and custom compute pipelines.
  • Memory-intensive FPGA designs  Leverage approximately 46 Mbits of embedded RAM for on-chip buffering, data staging, and table storage to reduce external memory dependence.
  • High-channel I/O systems  Support systems with many parallel sensors, ports, or peripheral channels using the 840 available I/Os.
  • Compact, high-pin-count boards  Deploy the 1932-ball FCBGA package in surface-mount designs that require a high pin count within a 45×45 mm footprint.

Unique Advantages

  • Substantial logic density: 490,000 logic elements allow consolidation of multi-function systems into a single device, simplifying board-level integration.
  • Large embedded memory: Approximately 46 Mbits of on-chip RAM enables significant local storage for buffering and algorithmic data without immediate reliance on external DRAM.
  • Extensive I/O connectivity: 840 I/Os provide flexibility for interfacing many peripherals, sensors, or parallel buses directly to the FPGA.
  • Commercial temperature rating: 0 °C to 85 °C specification aligns the device with standard commercial electronics applications.
  • High-pin-count package: The 1932-ball FCBGA (45×45) package concentrates signals in a compact footprint for dense board layouts.
  • Regulatory compliance: RoHS compliance supports environmentally regulated product designs.

Why Choose 5SGXMA5N1F45C1N?

The 5SGXMA5N1F45C1N offers a balanced combination of logic capacity, embedded memory, and I/O density in a high-pin-count FCBGA package, making it well suited to demanding commercial FPGA applications that require significant on-chip resources and broad connectivity. Its specified core voltage range and commercial temperature rating provide clear electrical and environmental boundaries for system design.

This device is appropriate for engineering teams seeking to integrate large amounts of custom logic and local memory into a single surface-mount FPGA solution, while maintaining a compact board footprint and adherence to RoHS requirements. Detailed device behavior and electrical characteristics are described in the Stratix V device documentation for design validation and implementation.

Request a quote or submit an inquiry to obtain pricing, lead-time information, or additional technical documentation for the 5SGXMA5N1F45C1N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up