5SGXMA5N1F40I2WN

The 5SGXMA5N1F40I2WN is a Stratix V GX FPGA offering a high-density programmable fabric with an industrial temperature grade. It combines approximately 490,000 logic elements, roughly 46.08 Mbits of embedded memory, and 600 user I/Os to support complex digital systems that require large logic capacity and dense external connectivity.

Packaged in a 1517-BBGA FCBGA (supplier package: 1517-FBGA 40×40) and specified for a core supply range of 870 mV–930 mV and an operating temperature range of −40 °C to 100 °C, this device targets robust designs that demand both integration and industrial-grade thermal performance.

Key Features

• Core Logic  Approximately 490,000 logic elements to implement large, complex digital designs and custom processing pipelines.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM for buffering, lookup tables, and intermediate data storage.
• High I/O Count  600 user I/Os to support dense external device interfacing and parallel data paths.
• Power and Supply  Core voltage supply specified from 870 mV to 930 mV for targeted core-power planning and system integration.
• Package and Mounting  1517-BBGA FCBGA package (supplier: 1517-FBGA 40×40) with surface-mount mounting type for compact, board-level integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet elevated ambient and industrial-environment requirements.
• RoHS Compliant  Device is RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Complex digital systems  Implement large-scale custom logic and processing functions using the device's high logic element count and embedded memory.
• Dense I/O interfaces  Support multi-channel data acquisition, parallel sensor arrays, or wide bus interfaces with 600 user I/Os.
• Industrial control and automation  Deploy in systems that require an industrial temperature rating (−40 °C to 100 °C) and robust integration in compact FCBGA packages.

Unique Advantages

• High logic density: Approximately 490,000 logic elements enable consolidation of complex functions into a single device, reducing system BOM and board area.
• Substantial on-chip memory: Approximately 46.08 Mbits of embedded RAM supports large buffering and fast on-chip data operations without external memory dependence.
• Extensive external connectivity: 600 user I/Os provide flexibility for mixed-signal front ends, multiple peripherals, and parallel interfaces.
• Industrial-rated operation: −40 °C to 100 °C operating range suits deployments in demanding environments where thermal resilience is required.
• Compact FCBGA package: 1517-BBGA FCBGA (1517-FBGA 40×40) offers a compact footprint for high-density board designs while supporting surface-mount assembly.
• Controlled core supply range: 870 mV–930 mV core supply specification aids precise power delivery design and system-level power management.

Why Choose 5SGXMA5N1F40I2WN?

The 5SGXMA5N1F40I2WN positions itself as a high-capacity, industrial-grade FPGA solution that brings together substantial logic resources, significant embedded memory, and a large I/O complement in a compact FCBGA package. Its specified core supply range and broad operating temperature make it suitable for designs that require predictable power characteristics and thermal robustness.

This device is a fit for engineering teams developing complex digital systems, dense I/O applications, and industrial automation equipment that benefit from integrated logic, memory, and connectivity in a single programmable device.

Request a quote or submit an RFQ through your preferred procurement channel to evaluate 5SGXMA5N1F40I2WN for your next project.