5SGXMA5N1F45C1G

The 5SGXMA5N1F45C1G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It provides very large logic capacity, substantial on‑chip RAM, and a high I/O count in a dense BGA package for commercial‑grade applications.

Designed for designs that require high logic density, abundant embedded memory, and extensive external connectivity, this device is suitable for complex digital processing and systems-level integration where on‑chip resources and I/O density matter.

Key Features

• Logic Capacity  Approximately 490,000 logic elements to implement large, complex digital designs.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM for buffering, state storage, and data processing.
• High I/O Count  840 device I/O pins to support wide external bus interfaces and dense peripheral connectivity.
• Power Supply  Core voltage range specified at 870 mV to 930 mV for the device core.
• Package & Mounting  1932‑BBGA (FCBGA) package; supplier device package listed as 1932‑FBGA, FC (45×45). Surface mount mounting type.
• Operating Range  Commercial temperature grade with operating temperature 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High‑density digital processing  Use the device’s large logic element count and embedded RAM for complex algorithms, packet processing, or custom hardware accelerators.
• High‑I/O systems  Leverage 840 I/Os for multi‑lane interfaces, wide buses, or boards requiring extensive external connectivity.
• System integration & prototyping  Combine the FPGA’s logic and memory resources in platform development, system validation, and integration tasks.

Unique Advantages

• Substantial on‑chip resources: Nearly half a million logic elements paired with approximately 46 Mbits of embedded memory reduces dependence on external logic and RAM.
• Extensive external connectivity: 840 I/Os enable flexible interfacing options for dense board designs and multi‑interface systems.
• Compact, production-ready package: 1932‑BBGA FCBGA footprint provides high pin density in a surface‑mount form factor for volume assemblies.
• Commercial temperature grade: Rated 0 °C to 85 °C for standard commercial applications and deployments.
• Regulatory compliance: RoHS compliance supports modern environmental and manufacturing requirements.

Why Choose 5SGXMA5N1F45C1G?

The 5SGXMA5N1F45C1G positions itself as a high‑capacity Stratix V GX FPGA option for designs that demand large programmable logic, substantial embedded memory, and broad I/O capability within a compact BGA package. Its electrical and package specifications make it well suited to complex digital systems developed for commercial temperature ranges.

Engineers and procurement teams can rely on the measurable device attributes—logic element count, on‑chip RAM, I/O count, package details, and listed operating and supply ranges—when evaluating this device for system‑level designs or platform development projects.

Request a quote or submit a pricing inquiry to receive availability, lead‑time, and ordering information for the 5SGXMA5N1F45C1G.