5SGXMA5N1F45C2LG

The 5SGXMA5N1F45C2LG is a commercial-grade Stratix V GX FPGA in a 1932-BBGA FCBGA package. It delivers high on-chip capacity with approximately 490,000 logic elements and approximately 46 Mbits of embedded memory, making it suitable for high-density, compute- and I/O-intensive designs.

Packaged as a surface-mount 1932-FBGA (45×45) device with up to 840 I/Os and a core voltage supply range of 820 mV to 880 mV, this device targets applications that require large logic resource counts, substantial embedded RAM, and significant I/O integration within a commercial temperature range (0 °C to 85 °C).

Key Features

• Core logic — Approximately 490,000 logic elements to implement large-scale digital logic, custom accelerators, and complex control/state machines.
• Embedded memory — Approximately 46 Mbits of on-chip RAM for buffering, packet storage, and on-chip data structuring.
• I/O capacity — Up to 840 I/Os to support dense external interfacing, parallel bus implementations, and multi-channel connectivity.
• Package and mounting — 1932-BBGA, FCBGA (supplier device package: 1932-FBGA, FC, 45×45) in a surface-mount form factor for system-level integration.
• Power supply — Core voltage supply range of 820 mV to 880 mV for designs targeting Stratix V core operating conditions.
• Commercial temperature grade — Rated for 0 °C to 85 °C operation (commercial grade).
• Stratix V GX family characteristics — As a member of the Stratix V GX family, the series documentation indicates GX channel transceiver speed grades available in the family (up to 14.1 Gbps for certain GX configurations).
• Regulatory status — RoHS compliant.

Typical Applications

• High-bandwidth signal processing — Large logic and embedded memory resources enable implementation of real-time processing pipelines and multi-channel data paths.
• Networking and switching — High I/O count and substantial on-chip RAM support packet buffering, parallel interface bridging, and custom switching logic.
• Prototyping and system integration — Dense logic capacity and a large I/O envelope make the device suitable for complex prototype platforms and integration into advanced systems.

Unique Advantages

• Large on-chip capacity: Approximately 490,000 logic elements and ~46 Mbits of embedded RAM reduce the need for external logic and memory, simplifying system BOM and board routing.
• High I/O density: Up to 840 I/Os enable direct interfacing to multiple parallel buses, sensors, or external devices without extensive glue logic.
• Compact, manufacturable package: 1932-BBGA FCBGA in a 45×45 supplier package supports surface-mount assembly for volume manufacturing while conserving board area.
• Commercial-grade thermal range: Rated for 0 °C to 85 °C operation, matching typical commercial embedded and enterprise system environments.
• Series-level transceiver capability: As part of the Stratix V GX family, the series documentation shows availability of high-speed GX channel options in the family, which can inform system-level planning for designs that may leverage transceiver features.
• RoHS compliant: Conforms to RoHS requirements to support regulatory needs in many regions.

Why Choose 5SGXMA5N1F45C2LG?

The 5SGXMA5N1F45C2LG is positioned for designers who need substantial on-chip logic and memory capacity combined with a high I/O count in a dense surface-mount package. Its commercial-grade rating, defined core supply window, and package density make it suitable for demanding embedded, networking, and signal-processing platforms where integration and compact board footprint are priorities.

Choosing this Stratix V GX FPGA provides a scalable foundation within the Stratix V family, offering a clear upgrade path and access to the family’s documented electrical and transceiver characteristics for informed system design and long-term product planning.

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