5SGXMA5N1F45C2WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,093 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5N1F45C2WN – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXMA5N1F45C2WN is a Stratix V GX family FPGA in a 1932-ball FCBGA package, targeting designs that require large programmable logic capacity and extensive I/O. It provides a substantial number of logic elements and on-chip memory combined with a high I/O count and commercial-grade operating parameters.
This device is well suited for systems that need dense programmable logic, significant embedded RAM, and broad interfacing capability while operating within standard commercial temperature and voltage ranges.
Key Features
- Logic Capacity Approximately 490,000 logic elements (logic cells) to implement complex digital designs and custom processing pipelines.
- Embedded Memory Approximately 46.08 Mbits of on-chip RAM to support buffering, lookup tables, and scratch memory for data-path and control logic.
- I/O Resources 840 user I/O pins to enable dense connectivity and flexible interfacing with external peripherals and systems.
- Package 1932-BBGA, FCBGA (supplier package: 1932-FBGA, FC) with a 45×45 mm footprint for high-pin-count board designs.
- Power and Supply Core voltage supply range of 870 mV to 930 mV to match system power delivery and core voltage domains.
- Mounting & Grade Surface-mount device, commercial grade with an operating temperature range of 0 °C to 85 °C.
- Standards Compliance RoHS-compliant manufacturing status.
Typical Applications
- High-density logic systems Implement large-scale state machines, datapath logic, and custom accelerators using the device’s extensive logic element count and embedded memory.
- Data buffering and packet processing Leverage the on-chip RAM and abundant I/O to handle buffering, packet manipulation, and protocol bridging in communication-centric equipment.
- Prototyping and system integration Use the high I/O count and package density for prototyping complex mixed-signal or multi-board systems that require significant interconnectivity.
Unique Advantages
- Large programmable fabric: 490,000 logic elements provide the resources to consolidate multiple functions into a single device.
- Significant embedded memory: Approximately 46.08 Mbits of RAM reduces dependency on external memory for intermediate storage and accelerates data-path operations.
- Extensive I/O capability: 840 I/Os simplify board-level routing and support high-density peripheral connectivity.
- High pin-count packaging: 1932-ball FCBGA package enables compact, high-density system implementations with substantial external interfacing.
- Commercial operating range: Designed for 0 °C to 85 °C operation to match typical commercial applications and deployments.
- Regulatory compliance: RoHS-compliant manufacturing supports environmental requirements for a wide range of markets.
Why Choose 5SGXMA5N1F45C2WN?
The 5SGXMA5N1F45C2WN positions itself as a high-capacity, I/O-rich commercial FPGA option within the Stratix V GX family, suitable for designs that demand a combination of large logic resources, substantial embedded RAM, and broad external connectivity. Its 1932-ball FCBGA package delivers the pin density needed for complex system designs while the specified core voltage and temperature range align with common commercial platform requirements.
This part is ideal for engineering teams consolidating multiple functions into a single FPGA, implementing large data-paths, or building prototypes that require abundant I/O and on-chip memory. The device’s specification set supports scalable designs with a focus on integration and board-level density.
Request a quote or submit an inquiry for 5SGXMA5N1F45C2WN to get pricing, availability, and technical support information tailored to your project.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018