5SGXMA5N1F45I2G

The 5SGXMA5N1F45I2G is a Stratix® V GX field-programmable gate array (FPGA) manufactured by Intel. It delivers a high-density programmable fabric with 490,000 logic elements and substantial on-chip RAM for complex, logic- and memory-intensive designs. Designed for industrial-grade applications, this device provides a large I/O count and a compact FCBGA package for board-level integration.

Key Features

• High-density logic: 490,000 logic elements for large-scale FPGA implementations and complex logic designs.
• Embedded memory: Approximately 46.08 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage.
• Rich I/O resources: 840 user I/O pins to accommodate extensive external interfaces and high pin-count designs.
• Power supply: Core voltage supply range from 870 mV to 930 mV, enabling predictable core power planning.
• Industrial operating range: Rated for −40 °C to 100 °C operation, suitable for industrial temperature environments.
• Package & mounting: 1932-BBGA (FCBGA) footprint; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type for standard PCB assembly.
• RoHS compliant: Conforms to RoHS environmental requirements.

Typical Applications

• High-density data processing: Implement large parallel compute blocks or custom accelerators using the device’s extensive logic and on-chip RAM.
• Networking and telecom infrastructure: Leverage the high I/O count and dense logic resources to build packet-processing, switching, or interface aggregation solutions.
• Industrial control and automation: Deploy in industrial systems that require industrial temperature operation and robust I/O connectivity.
• Signal processing and acquisition: Use the embedded memory and large logic capacity for real-time filtering, buffering, and protocol handling.

Unique Advantages

• Large programmable fabric: 490,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 46.08 Mbits of embedded RAM supports deep buffering and state storage without external memory.
• Extensive external connectivity: 840 I/Os provide flexibility for interfacing to a wide range of peripherals and high-pin-count designs.
• Industrial temperature rating: Specified for −40 °C to 100 °C, supporting deployments in industrial environments.
• FCBGA packaging for dense layouts: 1932-ball FCBGA (45×45) minimizes PCB footprint while delivering high I/O density for compact systems.
• Predictable power envelope: Defined core voltage range (870–930 mV) assists in power-supply design and thermal planning.

Why Choose 5SGXMA5N1F45I2G?

The 5SGXMA5N1F45I2G combines a very large logic capacity with tens of megabits of embedded RAM and a high I/O count in a single industrial-grade FCBGA package. This configuration is appropriate for engineers seeking to integrate multiple high-performance functions—data-path processing, protocol handling, and extensive I/O—onto one FPGA to reduce BOM and simplify system architecture.

Manufactured by Intel as part of the Stratix V GX family, this device offers the resources needed for scalable, long-lived deployments where robust thermal and voltage specifications are required. Its combination of density, memory, and I/O makes it a fit for demanding industrial, networking, and signal-processing designs.

Request a quote or submit an inquiry to obtain pricing, availability, and technical support information for the 5SGXMA5N1F45I2G.