5SGXMA5N3F40C3G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 46080000 490000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 692 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5N3F40C3G – Stratix® V GX Field Programmable Gate Array (FPGA), 490,000 logic elements, ~46.08 Mbits RAM, 600 I/Os
The 5SGXMA5N3F40C3G is a Stratix® V GX family FPGA in a 1517-BBGA FCBGA package designed for commercial applications that require very high logic density and substantial on-chip memory. With 490,000 logic elements, approximately 46.08 Mbits of embedded memory and 600 user I/Os, this device targets complex, memory- and I/O‑intensive digital designs.
Packaged for surface-mount assembly and specified for commercial temperature operation, the device is supplied with a core voltage range of 820 mV to 880 mV and is RoHS compliant. The Stratix V device datasheet provides the electrical and switching characteristics for the family, including core and I/O behavior.
Key Features
- High Logic Density — 490,000 logic elements to implement large-scale digital designs with complex combinational and sequential logic.
- On‑Chip Memory — Approximately 46.08 Mbits of total RAM bits for buffering, large lookup tables, and memory‑intensive algorithms.
- Extensive I/O — 600 user I/O pins to interface with high-channel-count systems and dense board-level connectivity.
- Package & Mounting — 1517‑BBGA FCBGA package (supplier device package: 1517‑FBGA 40×40); surface-mount for standard PCB assembly workflows.
- Operating Conditions — Commercial grade with an operating temperature range of 0°C to 85°C and a core voltage supply range of 820 mV to 880 mV.
- Compliance — RoHS compliant to meet common environmental and regulatory requirements.
Typical Applications
- High‑density digital systems — Implement large-scale logic functions and custom compute accelerators that require significant LUT and flip‑flop resources.
- Memory‑intensive designs — Use the substantial on‑chip RAM for buffering, lookup tables, and embedded data storage in complex pipelines.
- High‑I/O connectivity — Integrate with multi-channel interfaces, sensor arrays, and high‑pin-count peripherals using the device’s 600 I/Os.
Unique Advantages
- Large programmable fabric — 490,000 logic elements enable implementation of complex state machines, datapaths, and custom processing blocks without external logic.
- Significant embedded memory — Approximately 46.08 Mbits of RAM reduces dependency on external memory for many buffering and storage needs, simplifying board design.
- High I/O capacity — 600 I/Os provide the flexibility to connect to numerous peripherals or dense backplane and mezzanine interfaces.
- Commercial temperature rating — Specified 0°C to 85°C operation for mainstream commercial applications and environments.
- RoHS compliant — Meets environmental compliance expectations for commercial electronics manufacturing.
- Standard surface‑mount package — 1517‑BBGA FCBGA (1517‑FBGA 40×40) supports industry-standard PCB assembly processes.
Why Choose 5SGXMA5N3F40C3G?
This Stratix V GX device delivers a combination of high logic capacity, substantial on‑chip memory and a large I/O complement that addresses demanding commercial designs where integration density and memory resources are critical. Its FCBGA package and surface‑mount mounting support conventional manufacturing flows while the documented operating voltage and temperature ranges provide clear design constraints for system architects.
Engineers developing complex digital systems, memory‑heavy processing pipelines, or multi‑I/O controllers will find the 5SGXMA5N3F40C3G well suited to consolidate functionality on a single FPGA, helping reduce external components and simplify board layouts.
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