5SGXMA5N3F40C2WN

The 5SGXMA5N3F40C2WN is a Stratix V GX family FPGA delivered in a 1517-BBGA FCBGA package for surface-mount assembly. It provides a high-density programmable fabric with large on-chip memory and extensive I/O capacity suitable for commercial-temperature designs.

This device targets designs that require large logic capacity, substantial embedded RAM, and broad board-level connectivity while operating within a commercial temperature range. Core power rails operate between 870 mV and 930 mV, enabling designers to plan power delivery precisely.

Key Features

• Core capacity — Approximately 490,000 logic elements and 185,000 logic blocks for complex logic integration and high-density implementations.
• Embedded memory — Approximately 46 Mbits of on-chip RAM to support large data buffering and state storage without external memory in many use cases.
• I/O resources — 600 dedicated I/O pins to support extensive peripheral and board-level interfacing.
• Power — Core supply voltage range of 870 mV to 930 mV for accurate power budgeting and regulator selection.
• Package and mounting — 1517-BBGA (1517-FBGA, 40×40) FCBGA package in a surface-mount form factor for compact board layouts.
• Operating range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• High-density logic integration — Deploy the device where large numbers of logic elements and logic blocks are required to implement complex digital functions on a single FPGA.
• Embedded memory–intensive designs — Use the device’s approximately 46 Mbits of on-chip RAM for buffering, packet processing, and other memory-heavy functions.
• Board-level I/O aggregation — Leverage 600 I/Os to connect multiple peripherals, interfaces, and external components without immediate reliance on I/O expanders.
• Commercial embedded systems — Suitable for systems designed to operate across a 0 °C to 85 °C range where high logic density and memory are required.

Unique Advantages

• High programmable density: Approximately 490,000 logic elements provide headroom for large-scale FPGA implementations and iterative design expansion.
• Significant on-chip RAM: Approximately 46 Mbits of embedded memory reduces dependence on external memory for many buffering and state-storage tasks.
• Extensive I/O capacity: 600 I/O pins enable complex interfacing and reduce the need for external multiplexing or expansion.
• Compact FCBGA package: The 1517-BBGA (40×40) package supports high-density board layouts while remaining surface-mount compatible.
• Predictable power envelope: A defined core voltage range (870–930 mV) simplifies regulator selection and power-supply design.
• Commercial-temperature qualification: Rated for 0 °C to 85 °C operation to match standard commercial embedded product requirements.

Why Choose 5SGXMA5N3F40C2WN?

The 5SGXMA5N3F40C2WN combines substantial logic density, significant embedded RAM, and a high I/O count in a compact FCBGA package for commercial-temperature FPGA applications. As a member of the Stratix V GX family, it aligns with the Stratix V device ecosystem and datasheet-defined operating characteristics and speed-grade options.

This device is well suited to engineering teams that need a high-capacity, on-chip solution for complex digital processing, heavy buffering, and broad interface requirements while maintaining predictable power and thermal constraints for commercial deployments.

Request a quote or submit an inquiry to evaluate how 5SGXMA5N3F40C2WN can fit into your next design project.