5SGXMA5N3F40C2G

The 5SGXMA5N3F40C2G is an Intel Stratix V GX family FPGA in a 1517-ball FCBGA package, offering substantial programmable logic, embedded memory, and high I/O density for complex digital designs. It is a commercial-grade device with electrical and switching characteristics defined by the Stratix V series datasheet.

Designed for applications that require large logic capacity and extensive I/O, this device combines approximately 490,000 logic elements, roughly 46 Mbits of embedded RAM, and up to 600 I/O channels in a surface-mount 1517-FBGA (40×40) package. The device operates from a core supply of 870 mV to 930 mV and is specified for 0 °C to 85 °C operation.

Key Features

• Core Logic  Approximately 490,000 logic elements to implement high-density digital designs and complex datapaths.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM available for buffering, caching, and state storage.
• I/O Capacity  Up to 600 I/O pins to support broad interfacing needs across peripherals, memories, and high-speed links.
• Transceiver/Series Characteristics  Part of the Stratix V GX family with series-level transceiver speed grade information provided in the Stratix V device datasheet.
• Power and Voltage  Core supply specified from 0.870 V to 0.930 V to match system power-rail requirements.
• Package & Mounting  1517-ball BGA (FCBGA) surface-mount package; supplier package listed as 1517-FBGA (40×40) for compact, high-density board designs.
• Operating Grade  Commercial grade with operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High‑speed communications and networking  Large logic capacity and Stratix V GX family transceiver characteristics make this device suited to packet processing, protocol offload, and high-speed link endpoints.
• Data processing and acceleration  High logic density and abundant on-chip RAM support custom accelerators, complex signal processing, and inline data transformations.
• Board‑level system integration  600 I/O pins and a compact 1517-FBGA package enable integration with high-pin-count memories, peripherals, and I/O subsystems on space-constrained PCBs.

Unique Advantages

• High programmable capacity: 490,000 logic elements enable large-scale designs and multiple concurrent functions on a single device.
• Substantial embedded memory: Approximately 46 Mbits of on-chip RAM reduces external memory dependency for many buffering and caching tasks.
• Extensive connectivity: Up to 600 I/O pins provide flexibility for complex interfaces and board-level integration.
• Compact, high-density package: 1517-FBGA (40×40) surface-mount package supports dense system layouts without sacrificing pin count.
• Commercial temperature and RoHS compliance: Specified 0 °C to 85 °C operation and RoHS compliance help meet standard regulatory and environmental requirements.
• Tightly specified core supply: 0.870 V–0.930 V supply range supports predictable power planning and margining in system design.

Why Choose 5SGXMA5N3F40C2G?

The 5SGXMA5N3F40C2G delivers a balanced platform of logic density, embedded memory, and high I/O count in a compact FCBGA package, making it suitable for demanding commercial applications that need significant on-chip resources. As a Stratix V GX family device from Intel, it aligns with the electrical and switching characteristics defined in the Stratix V device datasheet.

Engineers and procurement teams seeking a commercially graded FPGA with robust capacity for complex data processing, communications, and integration tasks will find this device appropriate for designs that require scalability, predictable power requirements, and high pin count in a surface‑mount footprint.

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