5SGXMA5N2F45I3N

The 5SGXMA5N2F45I3N is a Stratix® V GX field programmable gate array (FPGA) in a high-density 1932-BBGA FCBGA package. This device provides large logic capacity, substantial embedded RAM, and high I/O density for demanding digital designs.

As a member of the Stratix V GX family, the device is suited to applications that require a combination of high logic element count, extensive on-chip memory, and broad I/O connectivity while operating across an industrial temperature range.

Key Features

• Core Logic  Approximately 490,000 logic elements to implement complex digital designs and state machines.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM for buffering, lookup tables, and DSP data storage.
• I/O Density  840 user I/Os to support high-channel-count interfaces and multi-lane connectivity.
• Transceiver Options (series-level)  Stratix V GX series transceiver speed grades include GX channel options such as 14.1 Gbps, 12.5 Gbps, and 8.5 Gbps (series-level datasheet information).
• Package & Mounting  1932-BBGA (FCBGA) package, supplier device package listed as 1932-FBGA, FC (45×45); surface-mount device for board-level integration.
• Power  Core supply operating range 820 mV to 880 mV.
• Temperature Grade  Industrial operating temperature range: –40°C to 100°C.
• Compliance  RoHS compliant.

Typical Applications

• High-speed serial communications  Leverage series transceiver speed-grade options and wide I/O count for multi-lane links and protocol bridging.
• Complex digital processing  Large logic capacity and substantial on-chip RAM enable implementation of intensive data-paths and control logic.
• Interface aggregation  High I/O density supports system designs that consolidate multiple peripherals and high-channel-count front-ends.

Unique Advantages

• High logic density: Approximately 490,000 logic elements provide the capacity for sophisticated, large-scale FPGA designs.
• Substantial on-chip memory: Approximately 46 Mbits of embedded RAM reduces reliance on external memory for buffering and scratch storage.
• Extensive I/O connectivity: 840 I/Os enable dense board-level interfacing and multi-protocol implementations.
• Industrial temperature range: Rated from –40°C to 100°C for deployment in temperature-demanding environments.
• Compact, high-pin-count package: 1932-BBGA (FCBGA) form factor supports high routing density while maintaining a surface-mount footprint.
• Controlled core power range: 820 mV–880 mV core supply range supports predictable power planning and system design.

Why Choose 5SGXMA5N2F45I3N?

The 5SGXMA5N2F45I3N combines very high logic capacity, a large complement of on-chip RAM, and significant I/O resources in a single industrial-grade FPGA package. It is positioned for designs that demand dense programmable logic, substantial memory for data buffering and processing, and broad connectivity while operating across an extended temperature range.

As part of the Stratix V GX family, the device benefits from documented series-level electrical and switching characteristics, enabling engineers to evaluate transceiver and core performance for integration into high-performance systems.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXMA5N2F45I3N and to discuss how this FPGA can meet your project requirements.