5SGXMA5N2F45I3LN

The 5SGXMA5N2F45I3LN is a Stratix® V GX field-programmable gate array (FPGA) from Intel, offering a high-density programmable fabric in a 1932-BBGA FCBGA package. It combines large programmable logic resources, substantial embedded memory, and a high I/O count for demanding industrial applications.

With 490,000 logic elements and approximately 46 Mbits of embedded memory, this device targets designs that require extensive on-chip logic, significant on-chip RAM, and broad external interfacing while operating across an industrial temperature range.

Key Features

• Programmable Logic  490,000 logic elements provide extensive capacity for complex logic, state machines, and custom data-path implementations.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM for buffering, lookup tables, and intermediate storage without relying on external memory.
• I/O Density  840 I/O pins support large ensembles of external interfaces, sensors, and high-pin-count connectors.
• Package  1932-BBGA (1932-FBGA, 45×45) FCBGA package supports a high-pin-count, compact footprint for dense PCB designs.
• Power  Core voltage supply range of 820 mV to 880 mV enables precise core power provisioning in system power architectures.
• Industrial Grade Temperature  Rated for operation from −40 °C to 100 °C to meet industrial temperature requirements.
• Design Family  Part of the Stratix V GX series, with electrical and switching characteristics documented in the Stratix V device datasheet for system-level integration.

Typical Applications

• Industrial control systems  Industrial-grade temperature range and high I/O count enable field I/O aggregation, real-time control logic, and rugged deployment.
• High-density logic implementations  Large logic element count and substantial embedded RAM allow integration of complex algorithms and large finite-state machines on-chip.
• I/O-intensive designs  Up to 840 I/Os facilitate complex sensor arrays, multi-port connectivity, and large connector interfaces.

Unique Advantages

• High on-chip integration: 490,000 logic elements coupled with approximately 46 Mbits of embedded memory reduce dependence on external components.
• Robust industrial operation: Rated −40 °C to 100 °C for deployment in environments that require extended temperature tolerance.
• Extensive interfacing capability: 840 I/O pins provide flexibility for multi-channel designs and high-pin-count system interconnects.
• Compact high-density package: 1932-BBGA (45×45) delivers a dense pinout in a compact footprint for space-constrained boards.
• Deterministic core power range: Specified 820–880 mV core supply supports controlled power delivery and thermal planning.
• Documented device family: Stratix V GX series electrical and switching parameters are available in the Stratix V device datasheet for system integration reference.

Why Choose 5SGXMA5N2F45I3LN?

The 5SGXMA5N2F45I3LN balances high logic capacity, substantial embedded memory, and a very large I/O complement in a single industrial-grade FPGA package. Its combination of 490,000 logic elements, approximately 46 Mbits of on-chip RAM, and 840 I/Os makes it well-suited to designs that demand dense on-chip functionality and extensive external interfacing while operating across a wide temperature range.

This device is aimed at engineers designing complex programmable systems who require a proven Stratix V GX family architecture, predictable core-voltage specifications, and a high-density FCBGA package for compact, reliable board designs.

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