5SGXMA5N2F45I2N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA

Quantity 1,162 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5N2F45I2N – Stratix® V GX Field Programmable Gate Array (FPGA)

The 5SGXMA5N2F45I2N is a Stratix V GX Field Programmable Gate Array in a 1932-ball FCBGA package targeted at industrial-grade embedded designs. This device combines high logic density, substantial on‑chip memory, and a large I/O count to address complex digital processing, system integration, and I/O‑intensive applications.

Key value comes from its 490,000 logic elements and approximately 46.08 Mbits of embedded memory, coupled with up to 840 I/Os and an industrial operating temperature range, enabling robust implementation of large, performance-oriented FPGA designs.

Key Features

  • Core Logic  490,000 logic elements provide significant capacity for implementing large state machines, datapaths, and custom hardware accelerators.
  • Embedded Memory  Approximately 46.08 Mbits of on‑chip RAM to support buffers, FIFOs, and data‑intensive processing without external memory dependence.
  • I/O Capacity  Up to 840 I/Os to support dense peripheral connectivity, parallel interfaces, and multi-channel systems.
  • Power Supply  Core supply voltage range of 870 mV to 930 mV to match platform power domains and enable defined core operation conditions.
  • Package  1932‑ball BGA (FCBGA / 45×45 mm nominal) providing a high‑pin‑count footprint for routing and thermal management on system boards.
  • Thermal & Environmental  Industrial operating temperature range from −40°C to 100°C and RoHS compliance for use in industrial environments.
  • Series Technical Foundation  As a Stratix V GX device family member, this device is described by series electrical and switching characteristics that cover operating conditions, power, and I/O timing.

Typical Applications

  • High‑performance signal processing  Use the device’s large logic and memory resources for DSP pipelines, protocol offload, and custom processing blocks.
  • Multi‑channel I/O systems  Leverage 840 I/Os for multiport interfaces, instrumentation front ends, and dense sensor aggregation.
  • Industrial control and automation  Industrial temperature rating and robust package make it suitable for demanding embedded controllers and motion control systems.
  • Prototyping and system integration  High logic capacity and on‑chip RAM enable integration of multiple subsystems and rapid prototype validation.

Unique Advantages

  • High logic density: 490,000 logic elements reduce the need to partition designs across multiple devices, simplifying system architecture.
  • Substantial on‑chip memory: Approximately 46.08 Mbits of embedded RAM supports large buffers and local data storage, lowering external memory requirements.
  • Extensive I/O connectivity: Up to 840 I/Os give flexibility for implementing parallel interfaces and multiple peripheral channels without external expanders.
  • Industrial thermal range: Rated from −40°C to 100°C for reliable operation in industrial environments where temperature resilience matters.
  • High‑pin‑count package: The 1932‑ball FCBGA delivers the routing density needed for complex board designs while supporting thermal dissipation strategies.
  • Standards‑aware design data: Device electrical and switching characteristics are specified in the Stratix V device documentation to support deterministic design choices.

Why Choose 5SGXMA5N2F45I2N?

The 5SGXMA5N2F45I2N positions itself for designs that require a combination of very large logic capacity, substantial embedded memory, and a high I/O count in an industrial‑rated package. Its core voltage range, package density, and series‑level electrical characterization make it suitable for complex embedded systems where integration and predictable behavior are important.

Choose this Stratix V GX device when your project needs scalable logic resources, significant on‑chip RAM to minimize external memory dependency, and a robust I/O complement for system consolidation—backed by the device documentation for electrical and timing guidance.

Request a quote or submit an inquiry for availability, lead times, and pricing to evaluate 5SGXMA5N2F45I2N for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up