5SGXMA5N2F45I2G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA

Quantity 706 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5N2F45I2G – Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA

The 5SGXMA5N2F45I2G is an Intel Stratix V GX field programmable gate array (FPGA) offered in an industrial temperature grade. It combines very high logic density, large on-chip memory, and a high I/O count in a 1932-ball FCBGA package for demanding, high-density system designs.

This device is appropriate for designs that require extensive programmable logic, substantial embedded memory, and large numbers of I/O pins, including applications that leverage the Stratix V family’s high-speed transceiver capabilities described in the device documentation.

Key Features

  • Logic Capacity  Approximately 490,000 logic elements and about 185,000 logic array blocks (LABs), enabling very large programmable logic implementations.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive logic functions.
  • I/O Density  840 user I/O pins to accommodate wide parallel interfaces, multi-channel connectivity, and complex board-level integration.
  • High‑Speed Transceiver Family  Part of the Stratix V GX family; family documentation lists multiple transceiver speed grades for high-speed serial designs (series datasheet).
  • Package & Mounting  1932-BBGA, FCBGA package (supplier device package: 1932-FBGA, FC, 45×45) with surface-mount construction for compact, board-level integration.
  • Power Supply  Core supply range specified at 870 mV to 930 mV to match targeted power and performance operating points.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for robust performance in industrial environments.
  • RoHS Compliance  Device is RoHS compliant.

Typical Applications

  • High‑performance digital signal processing  Large logic capacity and abundant embedded memory make this device suitable for complex DSP pipelines and data-path acceleration.
  • High‑density interface aggregation  High I/O count supports aggregation of multiple parallel interfaces and complex board-level I/O routing.
  • High‑speed serial/transceiver designs  As a Stratix V GX series device, it is applicable where high-speed transceivers are required per the family documentation.

Unique Advantages

  • High logic and memory integration: Combine nearly half a million logic elements with approximately 46 Mbits of on-chip RAM to consolidate functions into a single device and reduce external memory requirements.
  • Extensive I/O resources: 840 I/Os allow flexible connectivity options and simplify board-level interface design for dense systems.
  • Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in industrial environments where extended temperature performance is required.
  • Compact, high-pin‑count package: The 1932-ball FCBGA package provides a high pin count in a compact footprint for space-constrained, performance-driven boards.
  • Controlled core supply window: Defined 870 mV–930 mV core supply range enables predictable power planning and system-level integration.
  • Standards‑compliant manufacturing: RoHS compliance supports regulatory and environmental requirements for modern electronic products.

Why Choose 5SGXMA5N2F45I2G?

The 5SGXMA5N2F45I2G is positioned for designers who require a high-density FPGA with substantial embedded memory and a large number of I/Os in an industrial-grade package. Its combination of approximately 490,000 logic elements, roughly 46 Mbits of on-chip RAM, and 840 I/Os provides the capacity and connectivity to consolidate complex system functions into a single programmable device.

Backed by Intel/Altera Stratix V device documentation, this part is suited for high-performance, high-density designs where long-term availability, documented electrical characteristics, and industrial temperature operation are important considerations.

Request a quote or submit a purchase inquiry to get pricing and availability for the 5SGXMA5N2F45I2G.

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