5SGXMA5N2F45C3N

The 5SGXMA5N2F45C3N is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1932-BBGA FCBGA package designed for high-density, high-I/O applications. It delivers a large programmable fabric and embedded memory suitable for designs that require significant on-chip logic and routing capacity while operating within standard commercial temperature and voltage ranges.

With 490,000 logic elements, approximately 46 Mbits of embedded memory, and 840 I/O, this device is targeted at system designs that need extensive logic resources, large on-chip RAM, and broad external connectivity in a surface-mount BGA package.

Key Features

• Logic Fabric  Approximately 490,000 logic elements to support complex logic implementations and large-scale programmable designs.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM for buffering, lookup tables, and data processing without immediate external memory dependence.
• I/O Capacity  840 general-purpose I/O pins to accommodate wide parallel interfaces, multi-channel connectivity, and extensive board-level integration.
• Package and Mounting  1932-BBGA, FCBGA (supplier package: 1932-FBGA, FC 45×45) in a surface-mount format for high-pin-count board designs.
• Power Supply  Core voltage supply specified between 870 mV and 930 mV for alignment with platform power delivery requirements.
• Operating Grade and Temperature  Commercial grade device rated for operation from 0 °C to 85 °C for standard commercial applications.
• RoHS Compliance  Manufacturer-declared RoHS compliant status for environmental and regulatory alignment.

Typical Applications

• High-density compute and prototyping: Use where large logic capacity and embedded memory are required for FPGA-based compute engines or complex prototypes.
• Multi-channel I/O subsystems: Ideal for designs requiring many parallel interfaces or large numbers of peripheral connections thanks to 840 I/O.
• Data buffering and on-chip storage: Applications that rely on substantial on-chip RAM for packet buffering, LUTs, or intermediate data storage.
• Board-level integration in commercial products: Surface-mount 1932-BBGA package enables compact, high-pin-count board layouts for commercial devices.

Unique Advantages

• High logic density: Approximately 490,000 logic elements provide the headroom for complex state machines, datapaths, and control logic without external FPGA partitioning.
• Substantial embedded memory: Around 46 Mbits of on-chip RAM reduces reliance on external memory for many buffering and processing tasks.
• Large I/O footprint: 840 I/O pins simplify interfacing to wide buses, multiple peripherals, and high-channel-count systems.
• Compact, high-pin-count package: 1932-BBGA (45×45) offers a dense package solution for demanding board-level routing while supporting surface-mount assembly.
• Commercial temperature profiling: Rated 0 °C to 85 °C to fit standard commercial deployments without requiring industrial-grade qualification.
• RoHS compliant: Meets environmental compliance expectations for commercial electronics manufacturing.

Why Choose 5SGXMA5N2F45C3N?

The 5SGXMA5N2F45C3N positions itself as a high-density commercial FPGA option where large logic capacity, significant embedded memory, and broad I/O are primary design drivers. Its package and surface-mount form factor enable dense board designs while its specified core voltage and operating temperature align with common commercial platform requirements.

This device is suited for engineering teams and procurement looking for a scalable, high-resource FPGA for complex digital designs that demand extensive on-chip logic and memory with substantial board-level connectivity. RoHS compliance and the commercial temperature rating make it a practical choice for production-grade commercial electronics.

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