5SGXMA5N2F45C2WN

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA

Quantity 1,131 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5N2F45C2WN – Stratix® V GX Field Programmable Gate Array (FPGA), 1932-BBGA

The 5SGXMA5N2F45C2WN is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1932-BBGA FCBGA package. It provides high logic density and on-chip memory suitable for complex digital designs that require large I/O counts and dense embedded resources.

With 490,000 logic elements, approximately 46 Mbits of embedded RAM, and up to 840 user I/Os, this commercial-grade Stratix V GX device targets applications that demand substantial integration and flexible I/O connectivity while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

  • Logic Density  490,000 logic elements to implement large-scale combinational and sequential logic blocks.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM for buffering, lookup tables, and memory-mapped functions.
  • I/O Capacity  Up to 840 user I/Os to support wide parallel interfaces and multiple peripheral connections.
  • Package  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45) for compact board-level integration.
  • Power and Core Voltage  Core supply range of 870 mV to 930 mV to match system power-rail requirements and support the device’s core operation.
  • Mounting and Compliance  Surface-mount device, RoHS compliant for modern manufacturing processes.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for standard commercial applications.

Typical Applications

  • High-density digital processing  Large logic element count and on-chip RAM enable implementation of complex DSP, control, and processing pipelines.
  • I/O-intensive systems  Up to 840 I/Os allow integration with multiple buses, sensors, and high-channel-count peripherals on a single device.
  • Embedded system integration  Generous embedded memory and logic resources make the device suitable for consolidating functions to reduce board-level component count.

Unique Advantages

  • High integration density: 490,000 logic elements and substantial on-chip RAM reduce the need for external logic and memory components.
  • Broad I/O flexibility: Up to 840 I/Os support wide parallel interfaces and multiple peripheral subsystems without external multiplexing.
  • Compact board footprint: 1932-BBGA package provides a high-pin-count solution in a single compact package for space-constrained designs.
  • Commercial-grade operation: Rated for 0 °C to 85 °C, making the device suitable for a wide range of commercial electronic products.
  • Energy-focused core supply: Defined core voltage range (870 mV–930 mV) allows designers to plan power delivery and thermal budgets precisely.
  • Regulatory readiness: RoHS compliance supports manufacturability and environmental requirements.

Why Choose 5SGXMA5N2F45C2WN?

This Stratix V GX FPGA combines very large logic capacity and substantial embedded memory with a high I/O count in a single 1932-BBGA package, delivering a compact, highly integrated solution for demanding commercial designs. Its defined core voltage range, commercial temperature rating, and RoHS compliance make it straightforward to specify into systems that require predictable electrical and environmental behavior.

Designers and engineers building complex digital processing, I/O-rich subsystems, or consolidated embedded platforms will find the 5SGXMA5N2F45C2WN suited to projects that benefit from high on-chip resources and a high-pin-count package while retaining the supply and thermal planning clarity provided by the device’s published electrical and temperature ranges.

Request a quote or submit an inquiry to get pricing, lead-time, and availability for the 5SGXMA5N2F45C2WN Stratix V GX FPGA.

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