5SGXMA5N2F45C2LG

The Intel 5SGXMA5N2F45C2LG is a Stratix® V GX FPGA supplied in a 1932-BBGA (FCBGA) package. This commercial-grade FPGA integrates a large logic fabric, substantial on-chip memory, and a high I/O count for dense, board-level digital designs.

Key platform characteristics include 490,000 logic elements, approximately 46 Mbits of embedded memory, 840 I/O pins, a surface-mount 1932-FBGA package (45 × 45 mm footprint), a core supply range of 820 mV to 880 mV, and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic  490,000 logic elements provide a high-density programmable fabric for complex digital designs.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, large state machines, and memory-intensive logic.
• I/O Capacity  840 I/O pins enable wide parallel interfaces and extensive board-level connectivity.
• Package & Mounting  1932-BBGA (FCBGA) supplier package listed as 1932-FBGA, FC (45×45); surface-mount mounting for compact, high-density board designs.
• Power  Core supply voltage specified between 820 mV and 880 mV for predictable power planning and board-level power budgeting.
• Temperature & Grade  Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for environmental and regulatory conformance in commercial applications.

Typical Applications

• High‑logic capacity systems  Implement complex state machines, protocol stacks, or custom accelerators using the 490,000 logic elements.
• Memory‑intensive processing  Leverage approximately 46 Mbits of embedded memory for buffering, packet processing, and on-chip data storage.
• High‑I/O connectivity  Deploy in designs that require many parallel interfaces or rich board-level interconnectivity with 840 I/O pins.
• Commercial embedded platforms  Suitable for commercial-grade systems that operate within 0 °C to 85 °C and require RoHS compliance.

Unique Advantages

• High integration density: Consolidate large logic and memory functions into a single device, reducing board complexity and external components.
• Large on‑chip RAM: Approximately 46 Mbits of embedded memory supports data buffering and stateful logic without relying on external memory.
• Extensive I/O: 840 I/O pins allow flexible system interfaces, simplifying routing of parallel buses and peripheral connections.
• Compact surface‑mount package: 1932-FBGA (45×45) packaging delivers high pin count in a compact form factor for space‑constrained PCBs.
• Commercial grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for deployment in commercial electronics.

Why Choose 5SGXMA5N2F45C2LG?

The 5SGXMA5N2F45C2LG positions itself as a high-density Stratix V GX FPGA targeted at commercial applications that require significant logic capacity, sizable on-chip memory, and large I/O resources. Its combination of 490,000 logic elements, approximately 46 Mbits of embedded memory, and 840 I/Os makes it appropriate for complex digital designs where integration and board-level connectivity matter.

Use this device when your design needs a compact, surface-mount, RoHS-compliant FPGA solution with well-defined supply and operating-temperature requirements. Its package density and on-chip resources support consolidation of functions and can reduce external BOM for high-performance commercial systems.

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