5SGXMA5N2F45C2LN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,150 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5N2F45C2LN – Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA
The 5SGXMA5N2F45C2LN is a Stratix® V GX FPGA from Intel designed for high-density, programmable logic applications. This commercial-grade device combines a large logic capacity, substantial embedded memory, and extensive I/O to support complex digital designs and system integration.
With 490,000 logic elements, approximately 46 Mbits of on-chip RAM and 840 I/O pins in a 1932-BBGA FCBGA package, the device targets use cases that require dense logic, memory resources and a high I/O count while operating within a commercial temperature range.
Key Features
- Logic Capacity — 490,000 logic elements available for implementing large-scale digital designs and complex programmable logic.
- Embedded Memory — Approximately 46 Mbits of on-chip RAM to support buffering, state storage, and memory-hungry logic functions.
- I/O Density — 840 user I/O pins to enable interfacing with numerous peripherals, high-pin-count boards and multi-channel systems.
- Power and Core Supply — Core voltage supply specified between 820 mV and 880 mV for the device core rails.
- Package — 1932-BBGA FCBGA (supplier package: 1932-FBGA, FC 45×45) for high-density board-level integration.
- Mounting and Grade — Surface-mount device offered in a commercial grade with an operating temperature range of 0 °C to 85 °C.
- Compliance — RoHS compliant.
Typical Applications
- High-density digital processing — Use the large logic element count and embedded RAM to implement complex state machines, accelerators and data-path logic.
- Multi-channel I/O systems — Leverage 840 I/O pins for expansive peripheral interfacing, board-level aggregation and multi-lane connectivity.
- Prototyping and system integration — The combination of logic, memory and package density supports prototype development and integration into compact systems.
Unique Advantages
- Large, programmable fabric — 490,000 logic elements provide headroom for complex designs and feature-rich implementations.
- Significant on-chip memory — Approximately 46 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
- Extensive I/O — 840 I/O pins simplify system-level connectivity and reduce the need for external multiplexing.
- High-density packaging — 1932-BBGA FCBGA (45×45) delivers a compact footprint for designs that require high gate and I/O counts in a single package.
- Commercial-ready operating range — Designed for commercial applications with a specified operating temperature of 0 °C to 85 °C.
- RoHS compliant — Conforms to RoHS requirements for lead-free manufacturing processes.
Why Choose 5SGXMA5N2F45C2LN?
The 5SGXMA5N2F45C2LN positions itself as a high-capacity, commercial-grade FPGA suited for designs that demand significant logic resources, embedded memory and a large number of I/O signals in a single, surface-mount package. Its combination of 490,000 logic elements, approximately 46 Mbits of on-chip RAM and 840 I/O pins enables compact, integrated solutions for complex digital systems.
Choose this Stratix V GX device when your project requires scalable programmable logic, dense I/O integration and a high memory footprint within the commercial temperature envelope. The device’s package and electrical specifications support robust board-level integration and predictable deployment in commercial products.
Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXMA5N2F45C2LN.

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