5SGXMA5N2F45C2LN

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA

Quantity 1,150 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5N2F45C2LN – Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA

The 5SGXMA5N2F45C2LN is a Stratix® V GX FPGA from Intel designed for high-density, programmable logic applications. This commercial-grade device combines a large logic capacity, substantial embedded memory, and extensive I/O to support complex digital designs and system integration.

With 490,000 logic elements, approximately 46 Mbits of on-chip RAM and 840 I/O pins in a 1932-BBGA FCBGA package, the device targets use cases that require dense logic, memory resources and a high I/O count while operating within a commercial temperature range.

Key Features

  • Logic Capacity — 490,000 logic elements available for implementing large-scale digital designs and complex programmable logic.
  • Embedded Memory — Approximately 46 Mbits of on-chip RAM to support buffering, state storage, and memory-hungry logic functions.
  • I/O Density — 840 user I/O pins to enable interfacing with numerous peripherals, high-pin-count boards and multi-channel systems.
  • Power and Core Supply — Core voltage supply specified between 820 mV and 880 mV for the device core rails.
  • Package — 1932-BBGA FCBGA (supplier package: 1932-FBGA, FC 45×45) for high-density board-level integration.
  • Mounting and Grade — Surface-mount device offered in a commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • High-density digital processing — Use the large logic element count and embedded RAM to implement complex state machines, accelerators and data-path logic.
  • Multi-channel I/O systems — Leverage 840 I/O pins for expansive peripheral interfacing, board-level aggregation and multi-lane connectivity.
  • Prototyping and system integration — The combination of logic, memory and package density supports prototype development and integration into compact systems.

Unique Advantages

  • Large, programmable fabric — 490,000 logic elements provide headroom for complex designs and feature-rich implementations.
  • Significant on-chip memory — Approximately 46 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
  • Extensive I/O — 840 I/O pins simplify system-level connectivity and reduce the need for external multiplexing.
  • High-density packaging — 1932-BBGA FCBGA (45×45) delivers a compact footprint for designs that require high gate and I/O counts in a single package.
  • Commercial-ready operating range — Designed for commercial applications with a specified operating temperature of 0 °C to 85 °C.
  • RoHS compliant — Conforms to RoHS requirements for lead-free manufacturing processes.

Why Choose 5SGXMA5N2F45C2LN?

The 5SGXMA5N2F45C2LN positions itself as a high-capacity, commercial-grade FPGA suited for designs that demand significant logic resources, embedded memory and a large number of I/O signals in a single, surface-mount package. Its combination of 490,000 logic elements, approximately 46 Mbits of on-chip RAM and 840 I/O pins enables compact, integrated solutions for complex digital systems.

Choose this Stratix V GX device when your project requires scalable programmable logic, dense I/O integration and a high memory footprint within the commercial temperature envelope. The device’s package and electrical specifications support robust board-level integration and predictable deployment in commercial products.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXMA5N2F45C2LN.

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