5SGXMA5N2F45C3WN

The 5SGXMA5N2F45C3WN is a Stratix® V GX field programmable gate array (FPGA) in a 1932‑BBGA FCBGA package. It delivers a high number of logic elements, substantial on‑chip embedded memory, and a large I/O count for complex, high‑density digital designs.

Targeted at commercial applications, this device balances integration and system I/O capacity while operating within a commercial temperature range and a low core voltage window.

Key Features

• Core Logic  490,000 logic elements (logic cells) to implement large, complex digital designs and custom processing pipelines.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM for buffering, lookup tables, and algorithm acceleration.
• I/O Capacity  840 available I/O pins to support dense connectivity and parallel interfacing to multiple peripherals and external devices.
• Power Supply  Core voltage supply range specified at 820 mV to 880 mV for the device core.
• Package & Mounting  1932‑BBGA (FCBGA) package, supplier package listed as 1932‑FBGA, FC (45×45); surface‑mount device suitable for standard PCB assembly.
• Grade & Temperature  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS‑compliant construction for regulatory and material‑composition considerations.

Typical Applications

• Telecommunications & Networking  Use the high logic density and large I/O count for packet processing, protocol acceleration, and aggregation functions.
• High‑Performance Computing & Acceleration  Implement custom compute kernels and dataflow pipelines leveraging abundant logic elements and embedded RAM.
• Data Acquisition & Test Equipment  Integrate parallel sensor interfaces and real‑time processing blocks using the device's extensive I/O and memory resources.

Unique Advantages

• High‑density logic resources: 490,000 logic elements enable consolidation of complex functions onto a single device, reducing board count and interconnect complexity.
• Substantial on‑chip memory: Approximately 46 Mbits of embedded RAM provide local buffering and fast-access storage for high‑throughput designs.
• Extensive I/O capability: 840 I/Os offer flexibility for multi‑lane interfaces, broad peripheral connectivity, and system partitioning.
• Compact, surface‑mount package: 1932‑BBGA FCBGA form factor allows a dense footprint for space‑constrained systems while supporting standard PCB assembly processes.
• Commercial temperature and RoHS compliance: Suited for general commercial environments with material compliance for many global markets.

Why Choose 5SGXMA5N2F45C3WN?

The 5SGXMA5N2F45C3WN positions itself for designs that require a combination of very high logic capacity, significant embedded memory, and broad I/O provisioning in a single commercial‑grade FPGA. Its package and surface‑mount format support integration into compact PCBs while providing the resources needed for large, consolidated digital systems.

This device is appropriate for engineering teams building high‑density compute blocks, I/O‑heavy controllers, or custom data processing systems that benefit from substantial on‑chip memory and a large pool of logic elements.

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