5SGXMA5N2F45I3LG

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA

Quantity 756 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5N2F45I3LG – Stratix® V GX FPGA, 490,000 Logic Elements

The 5SGXMA5N2F45I3LG is a Stratix V GX field programmable gate array (FPGA) in an industrial-grade package. It provides large programmable logic capacity, substantial on-chip memory, and a high I/O count for complex, I/O‑intensive designs.

Designed for applications that require extensive logic resources and flexible I/O, this device pairs 490,000 logic elements with approximately 46.08 Mbits of embedded memory and support for Stratix V GX transceiver speed grades as documented in the device datasheet.

Key Features

  • Logic Capacity  490,000 logic elements for implementing large-scale digital systems and complex state machines.
  • Embedded Memory  Approximately 46.08 Mbits of on-chip RAM to support buffering, FIFOs, and data processing pipelines.
  • I/O Density  840 user I/Os to accommodate wide parallel interfaces and dense peripheral connectivity.
  • Transceiver Capability (Stratix V GX)  Stratix V GX family transceiver speed grades are defined in the Stratix V device datasheet for high-speed serial links (see family documentation for supported grades).
  • Power and Core Voltage  Core supply range of 820 mV to 880 mV to meet device operating requirements.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployments in temperature‑challenging environments.
  • Package and Mounting  Available in a 1932‑FBGA package (1932‑BBGA, FCBGA; supplier package: 1932‑FBGA, FC (45×45)) and intended for surface‑mount assembly.
  • Regulatory  RoHS compliant.

Typical Applications

  • High-density programmable logic systems  Use the device’s 490,000 logic elements and substantial embedded memory to implement complex FPGA-based processing, control and glue-logic functions.
  • I/O‑intensive designs  Leverage 840 I/Os for wide parallel interfaces, multi-channel data acquisition, and dense peripheral connectivity.
  • High-speed serial link systems  Apply Stratix V GX transceiver capabilities (see family datasheet) where multi-gigabit serial connectivity is required.
  • Industrial and embedded equipment  Industrial temperature rating (−40 °C to 100 °C) makes the device suitable for temperature‑sensitive embedded platforms.

Unique Advantages

  • Large programmable fabric: 490,000 logic elements enable implementation of complex algorithms and high gate-count designs without partitioning across multiple devices.
  • Substantial on-chip memory: Approximately 46.08 Mbits of embedded RAM reduces external memory dependence and simplifies board-level memory architectures.
  • High I/O count: 840 I/Os support wide parallel buses and multiple interfaces in a single package, lowering BOM complexity.
  • Industrial temperature capability: Rated operation from −40 °C to 100 °C for deployment in demanding thermal environments.
  • Compact high-pin‑count package: 1932‑FBGA (45×45) packaging delivers high pin density in a surface-mount form factor for space-constrained boards.
  • Defined core voltage range: 820 mV to 880 mV supply specification clarifies power delivery requirements for system design.

Why Choose 5SGXMA5N2F45I3LG?

The 5SGXMA5N2F45I3LG positions itself as a high-capacity Stratix V GX FPGA option for designs that demand extensive logic resources, large on-chip memory, and a high number of I/Os within an industrial temperature envelope. Its combination of 490,000 logic elements, approximately 46.08 Mbits of embedded memory, and 840 I/Os makes it suitable for complex, I/O-rich applications where board-level integration and thermal robustness are important.

This device is part of the Stratix V family and is covered by the Stratix V device datasheet, which provides device-level electrical and switching characteristics to support system design and qualification.

Request a quote or submit an inquiry for 5SGXMA5N2F45I3LG to receive pricing and availability information for your next design.

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