5SGXMA5N3F40C2LG

The 5SGXMA5N3F40C2LG is an Intel Stratix V GX family field programmable gate array (FPGA) offered in a commercial temperature grade. It provides high logic capacity and embedded memory in a 1517-FBGA (40×40) surface-mount package, and is specified for operation over a 0 °C to 85 °C range.

This device targets complex, logic‑intensive designs and transceiver‑enabled systems that require large I/O counts, substantial embedded RAM, and low‑voltage core operation.

Key Features

• Core Logic  Approximately 490,000 logic elements and 185,000 logic array blocks for implementing large combinational and sequential logic designs.
• Embedded Memory  Approximately 46.08 Mbits of on‑chip RAM to support deep buffering, FIFOs, and memory‑intensive processing tasks.
• I/O and Connectivity  Up to 600 user I/O pins to support wide parallel interfaces and multiple external peripherals.
• Transceiver‑Class Architecture  Stratix V GX devices include transceiver specifications and high‑speed channel capabilities as described in the device family datasheet.
• Power and Voltage  Core supply range specified at 820 mV to 880 mV for low‑voltage core operation.
• Package and Mounting  1517‑BBGA (FCBGA) package, supplier device package listed as 1517‑FBGA (40×40), surface‑mount mounting type for board‑level integration.
• Temperature and Grade  Commercial grade operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS‑compliant.

Typical Applications

• High‑speed serial/transceiver systems  FPGA fabric with Stratix V GX transceiver support and large logic/memory resources for serial link protocol implementation and data plane processing.
• Complex digital signal processing  Large logic element count and ~46 Mbits of embedded RAM enable DSP pipelines, packet buffering, and custom accelerator blocks.
• High‑I/O interface aggregation  600 I/O pins allow aggregation and bridging of multiple parallel interfaces or dense peripheral connectivity on a single device.

Unique Advantages

• High logic capacity: ~490,000 logic elements enable implementation of large, integrated digital systems without partitioning across multiple FPGAs.
• Substantial embedded memory: Approximately 46.08 Mbits of on‑chip RAM reduces dependence on external memory for buffering and accelerates data‑intensive tasks.
• Large I/O complement: Up to 600 user I/Os simplify board design when connecting to multiple peripherals or wide data buses.
• Low‑voltage core operation: Core supply specified between 820 mV and 880 mV for compatibility with power‑optimized system designs.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with a wide range of standard commercial applications.
• RoHS compliant and surface‑mount package: 1517‑FBGA (40×40) surface‑mount package facilitates modern assembly flows while meeting environmental requirements.

Why Choose 5SGXMA5N3F40C2LG?

The 5SGXMA5N3F40C2LG delivers a combination of high logic density, substantial on‑chip RAM, and a large I/O count in a compact 1517‑FBGA package. As a Stratix V GX family device, it is suitable for designs that require significant programmable logic, embedded memory, and transceiver‑class capabilities within a commercial temperature envelope.

This device is appropriate for engineering teams building logic‑heavy and transceiver‑enabled systems who need a single, integrated FPGA solution that supports dense designs, simplifies board partitioning, and adheres to RoHS requirements.

Request a quote or submit an RFQ to get pricing and availability for 5SGXMA5N3F40C2LG. Our team can provide lead‑time and ordering information to support your design schedule.