5SGXMA5N3F40C2N

The 5SGXMA5N3F40C2N is a Stratix V GX Field Programmable Gate Array (FPGA) IC designed for large-scale digital designs requiring high logic capacity, extensive I/O, and significant on-chip memory. It provides a combination of core logic, embedded memory, and I/O density in a 1517-ball FCBGA package suitable for surface-mount assembly.

With approximately 490,000 logic elements, roughly 46 Mbits of embedded memory, and 600 user I/Os, this commercial-grade device targets applications that need substantial programmable logic resources while operating within a 0 °C to 85 °C temperature range and a core supply window of 0.87–0.93 V.

Key Features

• Core Capacity  Approximately 490,000 logic elements for complex digital logic, large finite-state machines, and wide datapaths.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, packet storage, and algorithmic state.
• I/O Density  600 user I/Os to accommodate wide parallel buses, multiple interfaces, and extensive board-level connectivity.
• Package & Mounting  1517-BBGA (FCBGA) supplier package (1517-FBGA, 40×40) in a surface-mount form factor for compact board integration.
• Power  Core supply requirement specified between 0.870 V and 0.930 V to match system power-rail planning.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for commercial-environment deployments.
• RoHS Compliance  Device is RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High-density digital processing  Large logic capacity and on-chip RAM enable complex signal processing, protocol handling, and custom compute pipelines.
• Network and communications infrastructure  High I/O count supports multi-channel interfaces and broad board-level connectivity requirements.
• Prototyping and system integration  Substantial logic and memory resources make the device suitable for validating large FPGA-based subsystems and integrations.
• High-performance embedded systems  Embedded memory and logic scale for demanding embedded tasks where on-chip resources reduce external BOM.

Unique Advantages

• Large programmable fabric: Enables implementation of sizeable custom logic and complex controllers without immediate partitioning across multiple devices.
• Significant on-chip RAM: Approximately 46 Mbits of embedded memory reduces reliance on external memory for buffering and state storage.
• Extensive I/O footprint: 600 user I/Os provide design flexibility for parallel interfaces, mezzanine connectors, and dense routing requirements.
• Compact surface-mount package: 1517-ball FCBGA (40×40) facilitates high-density PCB layouts while maintaining thermal and electrical integration.
• Defined power window: A clear core supply range (0.87–0.93 V) simplifies power-supply design and verification activities.
• Commercial readiness: Commercial temperature rating (0 °C to 85 °C) and RoHS compliance support deployment in standard electronics environments.

Why Choose 5SGXMA5N3F40C2N?

The 5SGXMA5N3F40C2N combines high logic density, substantial embedded memory, and a large I/O complement in a surface-mount FCBGA package, delivering a compact yet capable platform for demanding programmable designs. Its commercial temperature grade, well-defined core voltage range, and RoHS compliance make it suitable for a wide range of commercial electronic systems where on-chip resources and I/O flexibility matter.

This device is ideal for engineers and system designers building high-density FPGA solutions that benefit from integrated memory and extensive connectivity while adhering to commercial-environment operating limits and regulatory requirements.

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