5SGXMA5N3F45C4N

The 5SGXMA5N3F45C4N is a Stratix V GX field‑programmable gate array (FPGA) in a 1932‑ball FCBGA package. It delivers very large logic capacity and on‑chip memory along with extensive I/O counts for dense, high‑function system designs.

As a member of the Stratix V GX family, this commercial‑grade device is intended for designs that require substantial embedded memory, abundant I/O resources, and the package and supply characteristics suitable for surface‑mount assembly.

Key Features

• Core logic  Approximately 490,000 logic elements for implementing large, complex digital designs.
• Embedded memory  Approximately 46 Mbits of on‑chip RAM to support buffering, FIFOs, and on‑device storage.
• I/O resources  Up to 840 I/O pins to support wide parallel interfaces and mixed I/O requirements.
• Power supply  Core supply operating range of 820 mV to 880 mV to match system power rails and core voltage requirements.
• Package & mounting  1932‑BBGA (FCBGA) package, supplier package listed as 1932‑FBGA, FC (45×45); surface‑mount mounting for standard PCB assembly.
• Operating temperature & grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• RoHS compliant  Environmentally compliant with RoHS status: Compliant.
• Family characteristics (Stratix V GX)  Part of the Stratix V GX family described in the device datasheet, which documents electrical and switching characteristics for Stratix V devices.

Typical Applications

• High‑density digital processing  Large logic capacity and embedded memory make this device suitable for complex DSP, compute, and control functions.
• High‑pin‑count interface systems  Extensive I/O (840 pins) supports multi‑lane parallel interfaces and board‑level connectivity.
• Prototyping and system‑level integration  Surface‑mount FCBGA package and commercial temperature range fit typical lab and production prototyping workflows.

Unique Advantages

• Substantial logic capacity: Enables implementation of large, multi‑function designs without immediate need for external logic expansion.
• Significant on‑chip memory: Approximately 46 Mbits of embedded RAM reduces dependence on external memory for buffering and intermediate storage.
• High I/O count: 840 I/Os provide flexibility for high‑bandwidth interfaces, wide buses, and mixed‑signal partitioning on a single device.
• Compact, production‑ready package: 1932‑ball FCBGA (45×45) supports surface‑mount assembly in compact system designs.
• Commercial temperature and RoHS compliance: Designed for standard commercial applications while meeting RoHS environmental requirements.

Why Choose 5SGXMA5N3F45C4N?

The 5SGXMA5N3F45C4N combines high logic density, sizable embedded memory, and a large number of I/O resources in a production FCBGA package, making it a solid choice for teams building complex digital systems that require on‑device resources and broad interface options. As a Stratix V GX family device, it aligns with the documented electrical and switching characteristics provided in the Stratix V device documentation.

This part is well suited to developers and system designers who need scalable logic capacity, extensive on‑chip RAM, and high I/O counts within a commercial temperature envelope and RoHS‑compliant manufacturing flow.

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