5SGXMA5N3F45I3G

The 5SGXMA5N3F45I3G is an industrial‑grade Stratix® V GX Field Programmable Gate Array (FPGA) in a 1932‑BBGA (FCBGA) package. It provides a high logic capacity device with a large number of I/O and substantial on‑chip memory, intended for high‑density, high‑integration FPGA designs.

This device combines 490,000 logic elements with approximately 46.08 Mbits of embedded memory and up to 840 I/O pins, delivering the resources needed for complex digital, signal‑processing, and high‑pin‑count integration tasks while supporting industrial temperature operation.

Key Features

• Core Capacity — 490,000 logic elements for large, complex designs and dense implementation of logic and control functions.
• Embedded Memory — Approximately 46.08 Mbits of on‑chip RAM to support buffering, packet processing, and algorithmic state storage.
• I/O Density — Up to 840 general I/O pins to support high‑pin‑count interfacing and parallel I/O requirements.
• High‑Speed Transceiver Capability (family) — The Stratix V GX family includes transceiver speed grades with channel rates up to 14.1 Gbps and 12.5 Gbps as documented in the family datasheet.
• Power Supply — Core voltage supply range of 820 mV to 880 mV for the device core power domain.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Package & Mounting — 1932‑BBGA (FCBGA) package; supplier device package listed as 1932‑FBGA, FC (45 × 45). Surface‑mount device.
• Regulatory — RoHS compliant.

Typical Applications

• High‑density logic implementations — Use where large logic capacity (490,000 logic elements) and substantial embedded memory are required for complex algorithms or control logic.
• High‑pin‑count interfaces — Systems requiring many parallel I/Os or multiple interfaces can leverage up to 840 I/Os for flexible board integration.
• Industrial systems — Rated for −40 °C to 100 °C operation, making it suitable for industrial applications that require extended temperature range operation.

Unique Advantages

• Large programmable fabric: 490,000 logic elements enable integration of complex functions on a single device, reducing external components and BOM complexity.
• Significant on‑chip memory: Approximately 46.08 Mbits of embedded RAM supports local buffering and state storage, improving data throughput and latency.
• Extensive I/O capability: Up to 840 I/Os allow dense board-level connectivity and support for multiple parallel interfaces without external expanders.
• Industrial temperature rating: −40 °C to 100 °C operation helps ensure reliable performance across a wide range of environmental conditions.
• High‑speed transceiver options (family): Stratix V GX family transceiver speed grades documented up to 14.1 Gbps enable high‑throughput serial links where applicable.
• Surface‑mount, high‑density package: 1932‑BBGA (FCBGA) with a 45 × 45 supplier package footprint supports compact, high‑pin‑count board designs.

Why Choose 5SGXMA5N3F45I3G?

The 5SGXMA5N3F45I3G positions itself as a high‑capacity, industrial‑grade FPGA offering substantial logic, memory, and I/O resources for complex system designs. Its combination of 490,000 logic elements, approximately 46.08 Mbits of embedded RAM, and up to 840 I/Os makes it suitable for designs that require on‑device integration of extensive digital functionality and high channel counts.

With a surface‑mount 1932‑BBGA package and an industrial operating range, this Stratix V GX device is aimed at engineering teams building robust, high‑density solutions that benefit from scalable FPGA resources and the documented transceiver options within the Stratix V GX family.

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