5SGXMA5N3F45I3N

The 5SGXMA5N3F45I3N is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a 1932-ball FCBGA package. It delivers high logic capacity and abundant on-chip memory for dense, programmable digital designs and systems that require substantial I/O and industrial temperature operation.

This device combines approximately 490,000 logic elements with roughly 46.08 Mbits of embedded memory and up to 840 configurable I/O pins, making it suitable for designs that need large programmable fabric, extensive I/O connectivity, and industrial-grade operating range.

Key Features

• Core Logic  Approximately 490,000 logic elements, providing high-density programmable logic for complex digital functions.
• Logic Blocks  185,000 logic blocks (as specified), enabling modular distribution of logic resources across designs.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM for buffers, FIFOs, and storage close to logic for low-latency architectures.
• I/O Capacity  840 I/O pins to support extensive external interfaces and board-level connectivity requirements.
• Package & Mounting  1932-BBGA (FCBGA) supplier device package: 1932-FBGA, FC (45×45). Surface-mount package for high-density board integration.
• Power Supply  Core supply range specified at 820 mV to 880 mV to match system power-rail planning.
• Temperature Grade  Industrial-grade operation from −40 °C to 100 °C for deployment in demanding thermal environments.
• Compliance  RoHS compliant.
• Family Transceiver Options  As a Stratix V GX family device, the series documentation includes transceiver speed-grade offerings across GX and GS devices (family-level characteristics provided in the device datasheet).

Unique Advantages

• High-density programmable fabric: The combination of ~490k logic elements and 185k logic blocks supports complex, resource-intensive designs without immediate migration to multiple devices.
• Large embedded memory: Approximately 46.08 Mbits of on-chip RAM reduces external memory dependence for many buffering and storage needs, simplifying board-level design.
• Extensive I/O headroom: 840 I/Os allow broad interfacing to peripherals, sensors, and high-channel-count systems while consolidating multiple functions into a single FPGA.
• Industrial temperature support: Rated from −40 °C to 100 °C for reliable operation across a wide range of environmental conditions.
• Compact, high-density package: 1932-ball FCBGA (45×45) enables high-pin-count implementations in a single package for space-constrained boards.
• Controlled core voltage range: Specified 820–880 mV core supply simplifies power architecture planning for systems targeting this device.

Why Choose 5SGXMA5N3F45I3N?

The 5SGXMA5N3F45I3N positions itself as a high-capacity Stratix V GX FPGA tailored for applications that require a large programmable logic fabric, substantial embedded RAM, and significant I/O resources within an industrial temperature envelope. Its FCBGA packaging and specified core voltage range support integration into compact, performance-driven boards where on-chip resources are a priority.

This device is appropriate for development teams and system designers who need a single-device solution to consolidate complex digital functions, leverage on-chip memory, and maintain robust operation across wide temperature conditions, backed by the Stratix V device documentation and specifications.

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