5SGXMA5N3F45I3LG

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA

Quantity 216 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5N3F45I3LG – Stratix® V GX FPGA, 490,000 logic elements, ~46 Mbits RAM, 840 I/Os

The 5SGXMA5N3F45I3LG is a Stratix V GX Field Programmable Gate Array (FPGA) IC offering very high logic density and abundant on-chip memory for complex, programmable hardware designs. As a Stratix V GX family device, it targets designs that require large programmable logic resources, substantial embedded RAM, and extensive I/O capability.

This device is supplied in a high-density 1932-BBGA FCBGA package, rated for industrial operation and optimized for surface-mount assembly. Key technical strengths include 490,000 logic elements, approximately 46 Mbits of embedded memory, and 840 I/Os—delivering the resources needed for demanding embedded, networking, and signal-processing applications.

Key Features

  • Core Logic  490,000 logic elements (cells) for high-density programmable logic implementations and complex design mapping.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM to support large buffers, FIFOs, and intermediate data storage.
  • I/O Capacity  840 I/Os to support wide parallel interfaces, multiple buses, and dense connectivity on system boards.
  • Power Supply  Core voltage range specified from 820 mV to 880 mV to match modern FPGA supply domains.
  • Package & Mounting  1932-BBGA FCBGA package (supplier: 1932-FBGA, FC 45×45) in a surface-mount form factor for compact, high-density board layouts.
  • Operating Range & Grade  Industrial temperature grade with an operating range of −40°C to 100°C for a broad set of environmental conditions.
  • Standards Compliance  RoHS compliant.

Typical Applications

  • High-performance networking and communications: Use the device’s large logic and I/O complement for packet processing, protocol offload, and multi-port interface aggregation in infrastructure equipment.
  • Data processing and acceleration: Deploy extensive logic resources and embedded RAM for custom compute kernels, streaming data paths, and application-specific acceleration.
  • Advanced signal processing: Implement DSP pipelines, large buffers, and complex state machines using the device’s memory and logic capacity.
  • Industrial control and instrumentation: Industrial-grade temperature range and broad I/O enable demanding control systems and instrumentation applications.

Unique Advantages

  • Highly integrated logic and memory: 490,000 logic elements combined with approximately 46 Mbits of embedded RAM reduces external memory dependence and simplifies BOM.
  • Extensive connectivity: 840 I/Os provide flexibility to interface with multiple subsystems, sensors, and high-pin-count peripherals.
  • Industrial readiness: Rated for −40°C to 100°C operation and supplied in a robust FCBGA package for reliable deployment in industrial environments.
  • Modern low-voltage core: Core supply between 820 mV and 880 mV aligns with contemporary power architectures for efficient board-level power distribution.
  • Space-efficient packaging: 1932-BBGA (45×45) package enables high-density board layouts while supporting the device’s large resource count.
  • Regulatory compliance: RoHS compliance helps simplify environmental and regulatory considerations.

Why Choose 5SGXMA5N3F45I3LG?

The 5SGXMA5N3F45I3LG delivers a combination of substantial programmable logic, embedded memory, and wide I/O capability in an industrial-grade, surface-mount BGA package. Its resource profile is suited to engineers developing complex, high-throughput systems that require on-chip capacity and extensive external interfacing.

This device is a practical choice for teams looking to scale algorithmic performance on programmable hardware while maintaining compatibility with industrial operating conditions and compact board-level implementations.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGXMA5N3F45I3LG and to discuss how it can fit into your next design.

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