5SGXMA5N3F45I3LG
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 216 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5N3F45I3LG – Stratix® V GX FPGA, 490,000 logic elements, ~46 Mbits RAM, 840 I/Os
The 5SGXMA5N3F45I3LG is a Stratix V GX Field Programmable Gate Array (FPGA) IC offering very high logic density and abundant on-chip memory for complex, programmable hardware designs. As a Stratix V GX family device, it targets designs that require large programmable logic resources, substantial embedded RAM, and extensive I/O capability.
This device is supplied in a high-density 1932-BBGA FCBGA package, rated for industrial operation and optimized for surface-mount assembly. Key technical strengths include 490,000 logic elements, approximately 46 Mbits of embedded memory, and 840 I/Os—delivering the resources needed for demanding embedded, networking, and signal-processing applications.
Key Features
- Core Logic 490,000 logic elements (cells) for high-density programmable logic implementations and complex design mapping.
- Embedded Memory Approximately 46 Mbits of on-chip RAM to support large buffers, FIFOs, and intermediate data storage.
- I/O Capacity 840 I/Os to support wide parallel interfaces, multiple buses, and dense connectivity on system boards.
- Power Supply Core voltage range specified from 820 mV to 880 mV to match modern FPGA supply domains.
- Package & Mounting 1932-BBGA FCBGA package (supplier: 1932-FBGA, FC 45×45) in a surface-mount form factor for compact, high-density board layouts.
- Operating Range & Grade Industrial temperature grade with an operating range of −40°C to 100°C for a broad set of environmental conditions.
- Standards Compliance RoHS compliant.
Typical Applications
- High-performance networking and communications: Use the device’s large logic and I/O complement for packet processing, protocol offload, and multi-port interface aggregation in infrastructure equipment.
- Data processing and acceleration: Deploy extensive logic resources and embedded RAM for custom compute kernels, streaming data paths, and application-specific acceleration.
- Advanced signal processing: Implement DSP pipelines, large buffers, and complex state machines using the device’s memory and logic capacity.
- Industrial control and instrumentation: Industrial-grade temperature range and broad I/O enable demanding control systems and instrumentation applications.
Unique Advantages
- Highly integrated logic and memory: 490,000 logic elements combined with approximately 46 Mbits of embedded RAM reduces external memory dependence and simplifies BOM.
- Extensive connectivity: 840 I/Os provide flexibility to interface with multiple subsystems, sensors, and high-pin-count peripherals.
- Industrial readiness: Rated for −40°C to 100°C operation and supplied in a robust FCBGA package for reliable deployment in industrial environments.
- Modern low-voltage core: Core supply between 820 mV and 880 mV aligns with contemporary power architectures for efficient board-level power distribution.
- Space-efficient packaging: 1932-BBGA (45×45) package enables high-density board layouts while supporting the device’s large resource count.
- Regulatory compliance: RoHS compliance helps simplify environmental and regulatory considerations.
Why Choose 5SGXMA5N3F45I3LG?
The 5SGXMA5N3F45I3LG delivers a combination of substantial programmable logic, embedded memory, and wide I/O capability in an industrial-grade, surface-mount BGA package. Its resource profile is suited to engineers developing complex, high-throughput systems that require on-chip capacity and extensive external interfacing.
This device is a practical choice for teams looking to scale algorithmic performance on programmable hardware while maintaining compatibility with industrial operating conditions and compact board-level implementations.
Request a quote or submit an inquiry to receive pricing and availability for the 5SGXMA5N3F45I3LG and to discuss how it can fit into your next design.

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