5SGXMA5N3F45C4NCV

The 5SGXMA5N3F45C4NCV is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. As a high-density, commercial-grade FPGA in a 1932-BBGA (FCBGA) package, it delivers a combination of large logic capacity, substantial on-chip memory, and extensive I/O for demanding programmable-logic applications.

This device is intended for designs that require significant logic resources and embedded memory while operating in commercial temperature environments; it is offered as part of the Stratix V family described in the device datasheet.

Key Features

• Core & logic capacity — 490,000 logic elements provide substantial programmable logic resources for complex designs and large-scale integration.
• Embedded memory — Approximately 46 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive algorithms without external memory for certain functions.
• High-density I/O — 840 I/Os enable wide parallel interfaces, multi-protocol connectivity, and dense board-level integration.
• Package & mounting — 1932-BBGA (FCBGA) package, supplier package 1932-FBGA, FC (45×45), designed for surface-mount assembly on compact, high-density PCBs.
• Low-voltage core supply — Core voltage range of 820 mV to 880 mV to match modern low-voltage system domains.
• Commercial temperature grade — Rated for operation from 0 °C to 85 °C for standard commercial deployments.
• RoHS compliant — Conforms to RoHS environmental requirements.

Typical Applications

• High-density programmable logic — Use the device where a large pool of logic elements is required to implement complex finite state machines, custom accelerators, or glue logic.
• Memory-intensive functions — On-chip RAM capacity supports buffering, packet processing, and data-path staging without relying solely on external memory.
• Dense I/O interfacing — The 840 I/Os suit applications requiring many parallel channels, multi-lane interfaces, or extensive sensor and peripheral connectivity.
• Commercial embedded systems — Ideal for commercial-temperature applications that need reprogrammable logic and high integration in a single FCBGA package.

Unique Advantages

• High logic density: 490,000 logic elements enable complex designs and large-scale integration on a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 46 Mbits of embedded RAM reduces dependency on external memory for many buffering and processing tasks.
• Extensive I/O capacity: 840 I/Os support broad connectivity options and high-channel-count systems without additional interface chips.
• Compact, production-ready package: The 1932-BBGA (FCBGA) package is optimized for surface-mount assembly and high-density PCB layouts.
• Low-voltage core compatibility: 820 mV–880 mV supply range aligns with low-voltage system domains for modern power-optimized designs.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial deployments.

Why Choose 5SGXMA5N3F45C4NCV?

The 5SGXMA5N3F45C4NCV delivers a balance of logic capacity, embedded memory, and abundant I/O in a single commercial-grade Stratix V GX device. Its combination of 490,000 logic elements, approximately 46 Mbits of on-chip RAM, and 840 I/Os makes it suitable for designs that demand high integration and reconfigurability while maintaining production-oriented packaging and mounting.

For engineers and procurement teams building complex, reprogrammable systems within a commercial temperature envelope, this Intel Stratix V GX FPGA provides a scalable platform backed by the Stratix V family specification set documented in the device datasheet.

If you would like pricing or availability information, request a quote or submit a product inquiry to begin the purchasing process for 5SGXMA5N3F45C4NCV.