5SGXMA5N3F45I3LN

The 5SGXMA5N3F45I3LN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC in a 1932-BBGA FCBGA package. It integrates 490,000 logic elements and approximately 46 Mbits of embedded memory to support large, complex digital designs while providing up to 840 I/Os for high-density interfacing.

Designed for industrial-grade deployments, this surface-mount FPGA operates across a core supply window of 820 mV–880 mV and an operating temperature range of –40 °C to 100 °C, making it suitable for demanding environments that require significant logic capacity and extensive connectivity.

Key Features

• Core Logic  490,000 logic elements (cells) to implement large-scale programmable logic and custom hardware functions.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, lookup tables, and embedded data storage.
• High-Density I/O  Up to 840 I/O pins to enable broad external device connectivity and parallel interfacing.
• Package & Mounting  1932-BBGA, FCBGA (supplier package: 1932-FBGA, FC 45×45) in a surface-mount form factor for high-pin-count designs.
• Power  Core voltage supply specified from 820 mV to 880 mV to match precise power-rail requirements.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliance  Device is RoHS compliant for environmental regulatory alignment.

Typical Applications

• Complex digital systems  Implement large-scale programmable logic and custom datapaths using the device’s high logic element count and embedded memory.
• High-density I/O platforms  Leverage up to 840 I/Os for board-level designs that require extensive external interfacing and parallel connectivity.
• Industrial control and instrumentation  Use the industrial temperature rating and robust BGA packaging for control systems operating across wide temperature ranges.

Unique Advantages

• Large logic capacity: 490,000 logic elements enable implementation of complex state machines, datapaths, and hardware-accelerated functions on a single device.
• Significant embedded memory: Approximately 46 Mbits of on-chip RAM reduce the need for external memory in many designs, simplifying BOM and board layout.
• Extensive I/O connectivity: 840 I/Os provide flexibility for high-channel-count systems, parallel buses, and dense peripheral integration.
• Industrial-grade operation: –40 °C to 100 °C operating range supports deployments in harsh or temperature-variable environments.
• Compact, high-pin-count package: The 1932-BBGA FCBGA (45×45) package offers a high I/O density in a surface-mount form factor suitable for modern PCB layouts.
• Regulatory alignment: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXMA5N3F45I3LN?

The 5SGXMA5N3F45I3LN delivers a combination of substantial logic resources, embedded memory, and high I/O count in a single Stratix® V GX device. Its industrial temperature rating and precise core voltage specification make it a practical choice for engineers designing complex, high-density systems that must operate reliably across challenging environments.

This device is suited to teams building large digital systems, high-channel-count interfaces, or industrial control solutions that benefit from integration of logic, memory, and extensive external connectivity while maintaining compliance with RoHS requirements.

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