5SGXMA5N3F45I4G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 316 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5N3F45I4G – Stratix® V GX Field Programmable Gate Array (FPGA)
The 5SGXMA5N3F45I4G is a Stratix V GX field programmable gate array optimized for high-density, high-I/O applications. It delivers substantial programmable logic capacity and embedded memory in a 1932-ball FCBGA package for surface-mount assembly.
Designed for industrial-grade deployments, this device targets systems that require large amounts of on-chip logic and memory, a high I/O count, and operation across a wide temperature range. Its value proposition centers on integration and capacity: hundreds of thousands of logic elements, tens of Mbits of embedded RAM, and extensive I/O in a single FPGA package.
Key Features
- Logic Capacity Approximately 490,000 logic elements for complex programmable logic implementations and high-density designs.
- Embedded Memory Approximately 46 Mbits of on-chip RAM to support large buffers, packet processing, and state storage without external memory.
- I/O Density 840 I/O pins to support broad connectivity and multi-protocol interfacing on complex PCBs.
- Power Supply Core voltage supply range of 820 mV to 880 mV, enabling design planning for power distribution and regulation.
- Package & Mounting 1932-ball BGA (FCBGA), supplier package 1932-FBGA, FC (45×45); surface-mount for compact PCB integration.
- Industrial Temperature Rated operating temperature range of −40 °C to 100 °C and an industrial grade designation for demanding environments.
- Series Transceiver Capability As part of the Stratix V GX family, the series supports GX transceiver speed grades (series datasheet documents transceiver channels up to 14.1 Gbps), useful for high-speed serial communications when used within the series capability.
- Environmental Compliance RoHS compliant to meet common environmental and assembly requirements.
Typical Applications
- High-density data processing Large programmable logic and significant on-chip memory make this FPGA suitable for DSP, packet processing, and custom accelerator tasks.
- Network and communications equipment High I/O count and Stratix V GX family transceiver capabilities support complex connectivity and high-speed serial interfaces used in networking gear.
- Industrial control and automation Industrial temperature rating and robust packaging enable deployment in control systems and factory automation that require durable, high-capacity programmable logic.
- Aerospace & defense systems Large logic capacity and extended temperature range support compute-intense subsystems in industrial and mission-critical embedded platforms.
Unique Advantages
- Highly integrated logic resource: The device’s ~490,000 logic elements reduce the need for multiple FPGAs or external logic, simplifying system architecture.
- Substantial on-chip RAM: Approximately 46 Mbits of embedded memory minimize external memory dependence and improve data locality for high-throughput designs.
- Extensive I/O capability: 840 I/O pins provide flexibility to implement multiple interfaces and large parallel data buses without external multiplexing.
- Industrial durability: Rated for −40 °C to 100 °C operation, enabling reliable use in harsh or temperature-variable environments.
- Compact, manufacturable package: 1932-ball FCBGA surface-mount package allows high-density PCB layouts while supporting automated assembly processes.
- RoHS compliance: Meets common regulatory and assembly requirements for environmentally conscious manufacturing.
Why Choose 5SGXMA5N3F45I4G?
The 5SGXMA5N3F45I4G combines very large programmable logic capacity and significant embedded memory with a high I/O count in a single industrial-grade FCBGA package. It is positioned for designers who need to consolidate complex logic, memory, and interface requirements into a compact FPGA solution while maintaining operation across a wide temperature range.
This device is well suited to teams building high-throughput processing, communications, and industrial embedded systems that benefit from the Stratix V GX family capabilities. The combination of logic density, on-chip RAM, and robust packaging supports scalable designs and reduces system BOM complexity.
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