5SGXMA7H1F35C1N

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 51200000 622000 1152-BBGA, FCBGA

Quantity 1,204 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7H1F35C1N – Stratix® V GX Field Programmable Gate Array (FPGA)

The 5SGXMA7H1F35C1N is a Stratix V GX Field Programmable Gate Array (FPGA) in a high-density FCBGA package. It provides a large logic fabric, extensive embedded memory, and abundant I/O to support designs that require significant on‑chip resources and high I/O counts.

Key architectural characteristics include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 552 I/Os. The device is offered in a commercial temperature grade with a core supply range of 870 mV to 930 mV and is RoHS compliant.

Key Features

  • High Logic Density 622,000 logic elements for implementing complex, large-scale digital designs and deep datapath logic.
  • Substantial Embedded Memory Approximately 51.2 Mbits of on‑chip RAM to support buffering, lookup tables, and dataflow acceleration without external memory in some applications.
  • Abundant I/O 552 user I/Os to accommodate wide parallel interfaces, multi‑lane connectivity, and dense board-level interconnects.
  • Power and Core Supply Core voltage supply specified from 870 mV to 930 mV to meet device operating requirements.
  • Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for standard commercial deployments.
  • Package and Mounting 1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA (35×35). Surface‑mount assembly compatible.
  • Standards Compliance RoHS compliant for environmentally responsible designs.
  • Documented Electrical and Switching Characteristics Datasheet content covers electrical characteristics, switching behavior, and I/O timing for design validation and system integration.

Typical Applications

  • High-density digital processing Large logic resource and on‑chip RAM make this device suitable for complex signal processing, algorithm acceleration, and custom compute blocks.
  • Interface aggregation High I/O count supports aggregation of multiple parallel interfaces, protocol bridging, and board‑level I/O expansion.
  • On‑chip buffering and data handling Approximately 51.2 Mbits of embedded memory enables local buffering and streaming data management for datapath designs.

Unique Advantages

  • Extensive Logic Resources: 622,000 logic elements allow implementation of large state machines, wide datapaths, and complex control logic without partitioning across multiple devices.
  • Large Embedded Memory: Approximately 51.2 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and LUT needs, simplifying BOM and layout.
  • Generous I/O Capacity: 552 I/Os provide flexibility for high‑pin‑count interfaces and dense routing requirements on modern PCBs.
  • Commercial Temperature Suitability: Rated 0 °C to 85 °C for standard commercial systems and environments.
  • RoHS Compliant: Designed to meet environmental compliance requirements for lead‑free manufacturing.
  • Packaged for Surface Mount Assembly: 1152‑BBGA / 1152‑FBGA (35×35) package supports compact, high‑density board designs.

Why Choose 5SGXMA7H1F35C1N?

The 5SGXMA7H1F35C1N delivers a balanced combination of high logic density, significant embedded memory, and broad I/O capability in a commercial‑grade Stratix V GX FPGA. These attributes make it well suited for engineers building complex digital systems that require large on‑chip resources and flexible I/O provisioning.

This device is appropriate for designs prioritizing integration and on‑chip memory capacity, offering a documented set of electrical and switching characteristics to support system validation and integration into surface‑mount assemblies.

Request a quote or submit an inquiry to obtain pricing, availability, and support for integrating the 5SGXMA7H1F35C1N into your next design.

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