5SGXMA7H1F35C2LG

The 5SGXMA7H1F35C2LG is a Stratix® V GX Field Programmable Gate Array (FPGA) in an FCBGA package, providing very high logic density and large on-chip memory for complex programmable-logic designs. It is a surface-mount commercial-grade device offered in a 1152-BBGA (1152-FBGA, 35×35) package optimized for designs that require substantial logic resources, embedded RAM, and a high I/O count.

This device’s key value arises from its combination of 622,000 logic element cells, approximately 51.2 Mbits of embedded memory, and 552 I/O pins, coupled with a low-voltage core (820 mV–880 mV) and a commercial operating range (0 °C to 85 °C).

Key Features

• Core Logic 622,000 logic element cells to support large and complex programmable logic implementations.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM for high-capacity buffering, state storage, and memory-intensive logic functions.
• I/O Capacity 552 I/O pins providing extensive external connectivity for multiple interfaces and peripherals.
• Power Domain Core supply voltage range of 820 mV to 880 mV for the device core domain.
• Package & Mounting Surface-mount 1152-BBGA (supplier device package: 1152-FBGA, 35×35) in an FCBGA form factor to support dense board-level integration.
• Operating Grade & Temperature Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Stratix V GX Series Transceiver Options (series-level) The Stratix V GX family includes transceiver speed grades documented in the device series datasheet.
• Regulatory Compliance RoHS compliant.

Unique Advantages

• High integration density: 622,000 logic element cells reduce the need for external glue logic by consolidating large designs on a single device.
• Substantial on-chip RAM: Approximately 51.2 Mbits of embedded memory allows for large buffers, packet queues, or FPGA-implemented memories without external DRAM.
• Extensive external connectivity: 552 I/Os enable multiple simultaneous interfaces and flexible board-level partitioning.
• Compact packaging for dense PCBs: The 1152-BBGA FCBGA package supports high-pin-count routing in a compact 35×35 form factor.
• Commercial-grade operation: Specified for 0 °C to 85 °C to match standard commercial electronic system environments.
• Low-voltage core domain: The 820 mV–880 mV supply range reflects modern low-voltage core operation for efficient power design.

Why Choose 5SGXMA7H1F35C2LG?

The 5SGXMA7H1F35C2LG positions itself for designs that demand very high logic density and substantial on-chip memory while maintaining a high I/O count in a compact FCBGA package. Its specifications make it suitable for integrating large programmable logic functions and memory-intensive blocks onto a single device, simplifying board design and reducing component count.

Engineers and procurement teams looking for a commercial-grade Stratix V GX FPGA with verified series-level transceiver options, RoHS compliance, and a proven package form factor will find this device appropriate for high-density, performance-oriented applications where on-chip resources and connectivity are primary selection criteria.

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