5SGXMA7H1F35C1G

The 5SGXMA7H1F35C1G is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, designed for high‑density programmable logic applications. It provides a large logic fabric, substantial embedded RAM, and a high I/O count in a compact 1152‑BBGA FCBGA package for surface‑mount designs.

With a commercial temperature grade and a defined core supply voltage window, this device targets complex digital systems that require extensive on‑chip resources and numerous external interfaces. The Stratix V family documentation also specifies GX channel transceiver speed grades at the family level.

Key Features

• Logic Capacity — 622,000 logic elements for implementing large, complex designs and dense custom logic.
• Embedded Memory — Approximately 51 Mbits of on‑chip RAM (51,200,000 bits) to support buffering, lookup tables, and memory‑intensive algorithms.
• I/O Count — 552 user I/O pins to support wide parallel interfaces and multiple high‑pin‑count peripherals.
• Package and Mounting — 1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA (35×35); surface‑mount mounting type for PCB assembly.
• Power — Core voltage supply range of 870 mV to 930 mV, enabling defined power‑planning for the core domain.
• Operating Range & Grade — Commercial grade with operating temperature from 0 °C to 85 °C.
• Compliance — RoHS compliant.
• Family‑Level Transceiver Options — Stratix V GX family documentation specifies GX channel transceiver speed grades (family‑level information is provided in the Stratix V datasheet).

Typical Applications

• Complex digital systems — Implement large custom logic, signal processing pipelines, and control engines that require high logic density and significant on‑chip RAM.
• High‑pin‑count interface designs — Use the 552 I/O pins to connect to multiple parallel buses, memory interfaces, or board‑level peripherals.
• Prototyping and system integration — Compact 1152‑BBGA package enables integration into high‑density PCBs for system development and verification.
• Designs needing well‑defined power domains — The specified 870–930 mV core supply range simplifies core power budgeting and regulation design.

Unique Advantages

• High logic density: 622,000 logic elements provide the capacity to implement large state machines, custom accelerators, and complex SoC‑style designs without external glue logic.
• Significant embedded memory: Approximately 51 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and storage tasks, simplifying board design.
• Extensive I/O support: 552 I/O pins allow flexible partitioning between high‑speed interfaces and general‑purpose signals to meet diverse system requirements.
• Compact high‑pin package: The 1152‑BBGA (35×35) FCBGA package delivers a high pin count in a space‑efficient footprint for dense board layouts.
• Commercial temperature grading: Rated for 0 °C to 85 °C, suitable for standard commercial‑environment applications.
• Standards‑aligned documentation: Backed by Stratix V family datasheet material that details electrical characteristics, operating conditions, and transceiver grade information at the family level.

Why Choose 5SGXMA7H1F35C1G?

The 5SGXMA7H1F35C1G positions itself as a high‑capacity, commercially graded FPGA option within the Stratix V GX family, offering a combination of large logic resources, substantial embedded memory, and a high I/O count in a 1152‑BBGA package. These attributes make it well suited for complex digital designs that need extensive programmable logic and on‑chip storage while maintaining a defined core power envelope and commercial temperature range.

Engineers and system designers who require a dense, surface‑mount FPGA with clear power and thermal operating points can leverage this device alongside the Stratix V family documentation for design planning and performance characterization.

Request a quote or submit a product inquiry to evaluate the 5SGXMA7H1F35C1G for your next design.