5SGXMA5N3F45I4WN

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA

Quantity 592 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5N3F45I4WN – Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA

The 5SGXMA5N3F45I4WN is a Stratix V GX family FPGA offered in an industrial temperature grade. It provides a high-density programmable fabric with 490,000 logic element cells and approximately 46 Mbits of embedded memory for complex logic and large on-chip buffering.

This device delivers a high I/O count (840 pins) and is supplied in a 1932-ball FCBGA package (supplier package: 1932-FBGA, FC, 45×45). Its operating range and core supply voltage make it suitable for demanding industrial systems that require large programmable capacity and robust thermal operating range.

Key Features

  • Logic Capacity  490,000 logic element cells for implementing large custom digital functions and deep datapaths.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM to support packet buffering, large lookup tables, and state storage without external memory.
  • I/O Density  Up to 840 I/O pins to interface with high-channel-count peripherals, memory buses, and multi-lane I/O subsystems.
  • Power and Core Supply  Core supply voltage specified at 820 mV to 880 mV to match system power-rail requirements for Stratix V devices.
  • Package and Mounting  1932-BBGA, FCBGA package in a 1932-FBGA supplier footprint (45×45) for high pin-count, surface-mount board designs.
  • Temperature and Grade  Industrial grade device rated for operation from −40 °C to 100 °C.
  • Compliance  RoHS compliant.

Unique Advantages

  • High integration density: 490,000 logic element cells and large embedded RAM reduce dependence on external logic and memory, simplifying board design.
  • High I/O count: 840 available I/Os enable complex multi-interface designs and direct connections to high-channel peripherals or parallel buses.
  • Industrial temperature rating: −40 °C to 100 °C operating range supports deployments in environments with wide temperature excursions.
  • Compact high-pin-count package: 1932-ball FCBGA (45×45) provides a dense package option for space-constrained, high-performance systems.
  • Power-defined core range: Core supply defined between 820 mV and 880 mV to match system voltage planning for Stratix V class devices.
  • Regulatory compliance: RoHS-compliant construction for environmentally-conscious designs.

Why Choose 5SGXMA5N3F45I4WN?

The 5SGXMA5N3F45I4WN places large FPGA capacity, significant on-chip memory, and a very high I/O count into a single industrial-grade FCBGA package. It is intended for engineers who need substantial programmable resources and robust thermal performance in a surface-mount form factor.

Its combination of 490,000 logic element cells, approximately 46 Mbits of embedded RAM, and support for industrial operating temperatures offers a scalable building block for complex FPGA-based systems while helping reduce external component count and board complexity.

Request a quote or submit an inquiry to receive pricing and availability for 5SGXMA5N3F45I4WN and to discuss how this Stratix V GX FPGA can fit into your next design.

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