5SGXMA5N3F45I4WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 592 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5N3F45I4WN – Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA
The 5SGXMA5N3F45I4WN is a Stratix V GX family FPGA offered in an industrial temperature grade. It provides a high-density programmable fabric with 490,000 logic element cells and approximately 46 Mbits of embedded memory for complex logic and large on-chip buffering.
This device delivers a high I/O count (840 pins) and is supplied in a 1932-ball FCBGA package (supplier package: 1932-FBGA, FC, 45×45). Its operating range and core supply voltage make it suitable for demanding industrial systems that require large programmable capacity and robust thermal operating range.
Key Features
- Logic Capacity 490,000 logic element cells for implementing large custom digital functions and deep datapaths.
- Embedded Memory Approximately 46 Mbits of on-chip RAM to support packet buffering, large lookup tables, and state storage without external memory.
- I/O Density Up to 840 I/O pins to interface with high-channel-count peripherals, memory buses, and multi-lane I/O subsystems.
- Power and Core Supply Core supply voltage specified at 820 mV to 880 mV to match system power-rail requirements for Stratix V devices.
- Package and Mounting 1932-BBGA, FCBGA package in a 1932-FBGA supplier footprint (45×45) for high pin-count, surface-mount board designs.
- Temperature and Grade Industrial grade device rated for operation from −40 °C to 100 °C.
- Compliance RoHS compliant.
Unique Advantages
- High integration density: 490,000 logic element cells and large embedded RAM reduce dependence on external logic and memory, simplifying board design.
- High I/O count: 840 available I/Os enable complex multi-interface designs and direct connections to high-channel peripherals or parallel buses.
- Industrial temperature rating: −40 °C to 100 °C operating range supports deployments in environments with wide temperature excursions.
- Compact high-pin-count package: 1932-ball FCBGA (45×45) provides a dense package option for space-constrained, high-performance systems.
- Power-defined core range: Core supply defined between 820 mV and 880 mV to match system voltage planning for Stratix V class devices.
- Regulatory compliance: RoHS-compliant construction for environmentally-conscious designs.
Why Choose 5SGXMA5N3F45I4WN?
The 5SGXMA5N3F45I4WN places large FPGA capacity, significant on-chip memory, and a very high I/O count into a single industrial-grade FCBGA package. It is intended for engineers who need substantial programmable resources and robust thermal performance in a surface-mount form factor.
Its combination of 490,000 logic element cells, approximately 46 Mbits of embedded RAM, and support for industrial operating temperatures offers a scalable building block for complex FPGA-based systems while helping reduce external component count and board complexity.
Request a quote or submit an inquiry to receive pricing and availability for 5SGXMA5N3F45I4WN and to discuss how this Stratix V GX FPGA can fit into your next design.

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