5SGXMA7H1F35C2G

The 5SGXMA7H1F35C2G is a Stratix V GX family FPGA IC from Intel designed for commercial embedded designs that require substantial on-chip logic, memory, and I/O resources. This device provides a large logic fabric, significant embedded RAM capacity, and a high I/O count in a 1152‑BBGA package, making it suitable for high-density FPGA implementations in commercial temperature environments.

Key Features

• Logic Capacity  622,000 logic elements provide a large programmable fabric for complex digital designs and extensive custom logic implementation.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffering, packet processing, and data-path storage requirements.
• I/O Resources  552 I/O pins to accommodate wide bus interfaces, numerous peripherals, and multi‑lane connectivity on a single device.
• Package & Mounting  1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA, 35×35) in a surface‑mount form factor to support compact board layouts.
• Power  Core voltage supply range of 870 mV to 930 mV for device core power domains.
• Temperature & Grade  Commercial grade operation with an operating range of 0 °C to 85 °C.
• Compliance  RoHS compliant for regulatory environmental requirements.

Typical Applications

• High-density signal processing  Utilize the 622,000 logic elements and approximately 51.2 Mbits of embedded memory to implement large-scale digital signal processing pipelines and custom accelerators.
• Complex protocol bridging  High I/O count (552) enables multi-interface bridging and protocol translation on a single FPGA device.
• Large-scale control and compute  Deploy extensive custom control logic and parallel compute blocks leveraging the device’s large logic and memory resources for commercial embedded systems.

Unique Advantages

• High logic and memory density: 622,000 logic elements combined with approximately 51.2 Mbits of embedded RAM support complex, memory‑intensive designs without immediate external memory dependence.
• Extensive I/O capability: 552 I/Os reduce the need for external multiplexing and simplify multi‑interface designs.
• Compact board integration: 1152‑BBGA (1152‑FBGA, 35×35) surface‑mount package enables dense PCB layouts while providing large device capacity.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to meet a wide range of commercial deployment environments.
• Regulatory alignment: RoHS compliance supports environmental and manufacturability requirements.
• Defined core supply range: 870 mV to 930 mV core voltage specification simplifies power planning for system designers.

Why Choose 5SGXMA7H1F35C2G?

The 5SGXMA7H1F35C2G offers a combination of large logic capacity, substantial embedded memory, and a high pin count in a compact 1152‑BBGA package, tailored for commercial applications that demand dense programmable logic and abundant I/O. As a Stratix V GX family device from Intel, it aligns with device‑level electrical and switching characteristics documented for the Stratix V series.

This device is suited to design teams building scalable, compute‑ and I/O‑intensive FPGA solutions where on‑chip resources and package density are primary selection criteria.

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