5SGXMA5N3F45I3WN

The 5SGXMA5N3F45I3WN is an industrial-grade Stratix V GX field programmable gate array (FPGA) provided by Intel. It delivers high logic density, substantial embedded memory, and a large I/O complement in a 1932-ball FCBGA package suited for surface-mount PCB integration.

Designed for systems that require large-scale programmable logic and extensive I/O, this device provides a consolidated platform for complex programmable designs while operating across an industrial temperature range and a low-voltage core supply.

Key Features

• Core Logic  Approximately 490,000 logic elements for high-density programmable logic implementation.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM to support large buffers, state machines, and memory-intensive logic.
• I/O Capability  Up to 840 I/Os to support wide external interfacing and high pin-count system requirements.
• Package & Mounting  1932-BBGA (FCBGA) supplier device package (1932-FBGA, FC 45×45) intended for surface-mount assembly.
• Power  Core supply voltage range of 820 mV to 880 mV for the device core operating domain.
• Temperature Rating  Industrial operating temperature range from −40°C to 100°C.
• Manufacturer  Intel (Stratix V family); device documentation and electrical characteristics are provided in the Stratix V device datasheet.
• Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic  Implement large custom datapaths, control logic, and state machines using approximately 490,000 logic elements.
• Memory-intensive designs  On-chip embedded memory (≈46 Mbits) for buffering, LUT RAM, and packet or frame storage within a single device.
• High I/O aggregation  Systems requiring extensive external interfacing or parallel I/O lanes can leverage up to 840 available I/Os.
• Industrial deployments  Designed for operation across −40°C to 100°C for industrial-environment applications.

Unique Advantages

• High logic density:  Approximately 490,000 logic elements enable consolidation of complex subsystems into a single FPGA, reducing board-level component count.
• Substantial on-chip RAM:  Approximately 46.08 Mbits of embedded memory reduce dependency on external memory for many buffering and storage tasks.
• Extensive I/O:  Up to 840 I/Os allow broad connectivity options for high-pin-count requirements and flexible system partitioning.
• Industrial temperature range:  Rated from −40°C to 100°C for reliable operation in demanding environments.
• Compact FCBGA package:  1932-ball FCBGA (45×45 mm) supports high-density routing and compact system integration on surface-mount PCBs.
• Low-voltage core domain:  820 mV to 880 mV core supply window supports designs targeting low-voltage FPGA core operation.

Why Choose 5SGXMA5N3F45I3WN?

The 5SGXMA5N3F45I3WN positions itself for designs that demand high logic capacity, significant on-chip memory, and extensive I/O in an industrial-temperature FPGA. Its combination of approximately 490,000 logic elements, roughly 46 Mbits of embedded RAM, and 840 I/Os consolidates complex system functions into a single device footprint, simplifying board-level design and reducing component count.

Backed by the Stratix V family documentation from Intel, this device is suitable for development teams and procurement focused on scalable, high-density programmable logic solutions where industrial temperature operation and RoHS compliance are required.

Request a quote or submit an inquiry to evaluate availability and obtain pricing information for the 5SGXMA5N3F45I3WN.