5SGXMA5N3F45I4N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,787 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5N3F45I4N – Stratix® V GX Field Programmable Gate Array (FPGA)
The 5SGXMA5N3F45I4N is an Intel Stratix V GX FPGA supplied in a 1932-pin FCBGA package for surface-mount applications. Designed for high-density, memory- and I/O-intensive designs, this industrial-grade device delivers large programmable logic capacity and substantial on-chip RAM for complex digital systems.
Key value propositions include a very large logic resource pool (490,000 logic elements), approximately 46.08 Mbits of embedded memory, and up to 840 user I/Os — enabling integration of extensive logic, buffering, and external interfacing within a single device footprint.
Key Features
- Logic Capacity — 490,000 logic elements to implement large-scale digital functions and complex custom logic.
- Embedded Memory — Approximately 46.08 Mbits of on-chip RAM to support deep buffering, FIFOs, and memory-intensive algorithms.
- I/O Density — Up to 840 user I/Os for extensive external connectivity and system integration.
- Power Supply — Core voltage supply range of 820 mV to 880 mV to match system power rails and enable expected core performance.
- Package & Mounting — 1932-BBGA (FCBGA) package, 1932-FBGA supplier package (45 × 45 mm), supplied as a surface-mount component to support compact PCB layouts.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Regulatory Compliance — RoHS compliant.
Typical Applications
- High-density digital systems — Implement very large custom logic functions and system controllers using the device’s extensive logic elements and embedded memory.
- Memory-intensive processing — Use the approximately 46.08 Mbits of on-chip RAM for buffering, packet processing, or streaming data pipelines.
- High-pin-count interfacing — Deploy in systems requiring many parallel or serialized external interfaces leveraging up to 840 user I/Os.
- Industrial control and automation — Industrial temperature rating and surface-mount package make the device suitable for robust control platforms and industrial equipment.
Unique Advantages
- Large integrated logic and memory: 490,000 logic elements combined with approximately 46.08 Mbits of embedded RAM reduce the need for external components and simplify board design.
- High I/O count: 840 user I/Os enable broad system connectivity without requiring additional bridge devices or I/O expanders.
- Industrial readiness: −40 °C to 100 °C operating range supports deployment in demanding temperature environments.
- Compact system-level packaging: 1932-pin FCBGA package delivers high integration density in a surface-mount form factor for space-constrained PCBs.
- Standards-aligned manufacturing: RoHS compliance facilitates integration into modern, regulation-aware production processes.
Why Choose 5SGXMA5N3F45I4N?
The 5SGXMA5N3F45I4N positions itself where large programmable capacity, significant on-chip memory, and substantial I/O converge in an industrial-grade FPGA. Its combination of 490,000 logic elements, approximately 46.08 Mbits of embedded RAM, and up to 840 I/Os supports consolidation of complex digital subsystems into a single device, reducing BOM count and simplifying board-level integration.
Engineers and procurement teams evaluating high-density, memory-rich FPGA solutions will find this Stratix V GX device suitable for demanding industrial applications that require robust temperature tolerance, a compact FCBGA package, and compliance with RoHS requirements.
If you would like pricing, lead-time information, or to request a formal quote for 5SGXMA5N3F45I4N, submit a product inquiry or request a quote today to start the procurement process.

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