5SGXMA7K2F40I3

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

Quantity 771 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7K2F40I3 – Stratix® V GX FPGA, 622,000 Logic Elements

The 5SGXMA7K2F40I3 is a Stratix® V GX field programmable gate array (FPGA) in a 1517-BBGA (FCBGA) package, designed for complex digital designs that require high logic capacity, abundant on-chip memory, and a large I/O footprint. With an industrial temperature grade and a tightly specified core voltage range, this device targets applications that demand robust operation across extended temperature and power envelopes.

As a member of the Stratix V GX family, the device is positioned for designs that need significant integration of logic, memory, and I/O, along with the series’ documented transceiver speed grade options described in the family datasheet.

Key Features

  • Core Logic  622,000 logic elements provide a large fabric for implementing complex FPGA designs and system-level integration.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive processing tasks.
  • I/O Capacity  696 general-purpose I/O pins to support broad peripheral, bus, and high-density connectivity requirements.
  • Transceiver Capability (Series)  Stratix V GX family transceiver speed grades are documented in the Stratix V series datasheet (series-level capability includes channel rates referenced in the device family documentation).
  • Power  Specified core voltage supply range of 820 mV to 880 mV to match tightly controlled power-rail designs.
  • Thermal and Grade  Industrial operating temperature range from −40 °C to 100 °C to support deployment in demanding environments.
  • Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), surface-mount for high-density PCB assembly.
  • Regulatory  RoHS-compliant.

Typical Applications

  • Telecommunications & Networking  Large logic capacity and extensive I/O make the device suitable for packet processing, line cards, and network aggregation functions where on-chip memory and high pin counts are required.
  • High-Performance Signal Processing  The combination of hundreds of thousands of logic elements and approximately 51.2 Mbits of RAM supports DSP, video processing, and data-path acceleration tasks.
  • Industrial Control & Automation  Industrial-grade temperature rating (−40 °C to 100 °C) and robust I/O enable deployment in factory automation, motor control interfaces, and rugged instrumentation.
  • Test & Measurement  High I/O density and large on-chip resources suit modular test equipment, data acquisition front-ends, and timing-critical measurement systems.

Unique Advantages

  • Substantial Logic Capacity:  622,000 logic elements allow implementation of complex multi-function systems on a single device, reducing component count.
  • Large Embedded Memory:  Approximately 51.2 Mbits of on-chip RAM reduces dependence on external memory for buffering and real-time data processing.
  • High I/O Density:  696 I/O pins support rich peripheral connectivity and multi-channel interfacing without extensive external multiplexing.
  • Industrial Temperature Rating:  Rated from −40 °C to 100 °C for reliable operation in temperature-challenging environments.
  • Compact BGA Package:  The 1517-BBGA (1517-FBGA supplier package) provides a high-pin-count solution in a compact footprint for space-constrained PCBs.
  • Controlled Core Voltage Window:  A defined 820 mV–880 mV supply range aids predictable power delivery and thermal planning for system designers.

Why Choose 5SGXMA7K2F40I3?

The 5SGXMA7K2F40I3 is well suited for engineers building systems that require a combination of large logic resources, substantial embedded memory, and a high number of I/Os in an industrial-temperature FPGA. Its package and electrical specifications make it appropriate for designs where integration density and predictable power and thermal behavior are important.

As a Stratix V GX family device, it maps into a series with defined transceiver speed grade options and family-level electrical characteristics documented in the Stratix V device datasheet, making it an option for designs that scale across the Stratix V portfolio.

To request a quotation or submit an inquiry for part number 5SGXMA7K2F40I3, please provide your project requirements and quantity needs and we will respond with pricing and availability.

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