5SGXMA7K2F40I3LG
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,744 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXMA7K2F40I3LG – Stratix® V GX FPGA (622,000 logic elements, ~51.2 Mbits RAM, 696 I/Os)
The 5SGXMA7K2F40I3LG is an Intel Stratix V GX Field Programmable Gate Array (FPGA) offered in an industrial temperature grade. It provides a large fabric of logic elements and significant embedded memory combined with extensive I/O, suitable for complex, high‑density digital designs.
This device targets applications that require substantial programmable logic capacity, on‑chip memory, and numerous external interfaces while operating across an industrial temperature range and standard surface‑mount packaging.
Key Features
- Logic Capacity 622,000 logic elements implemented across 234,720 logic array blocks, enabling large programmable designs.
- Embedded Memory Approximately 51.2 Mbits of on‑chip RAM for buffering, state storage, and local data processing.
- Extensive I/O 696 general I/O pins to support high pin‑count interfacing and multi‑lane connectivity options.
- Package & Mounting 1517‑BBGA FCBGA package (supplier device package: 1517‑FBGA, 40×40) in a surface‑mount form factor for board‑level integration.
- Power Supply Core voltage supply range: 820 mV to 880 mV.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for deployment in thermally demanding environments.
- Environmental Compliance RoHS compliant.
Typical Applications
- High‑density digital processing Large logic and memory resources enable complex state machines, custom datapaths, and parallel compute kernels.
- Network and communications equipment Extensive I/O count supports dense front‑end connectivity and multi‑channel interface requirements.
- Signal processing and acceleration On‑chip RAM and abundant logic elements are suitable for buffering, filtering, and low‑latency data flow operations.
- System prototyping and integration The combination of logic capacity, memory, and I/O makes this device well suited for prototyping complex FPGA‑based subsystems.
Unique Advantages
- Large programmable fabric: 622,000 logic elements provide the headroom to implement complex logic and multi‑module designs on a single device.
- Significant on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces reliance on external memory and shortens data paths.
- High I/O density: 696 I/Os enable extensive interfacing without multiple bridge devices, simplifying board routing and BOM.
- Industrial operating range: −40 °C to 100 °C rating supports deployments in thermally varied environments.
- Standard surface‑mount packaging: 1517‑BBGA FCBGA (1517‑FBGA, 40×40) provides a compact, board‑level footprint for high‑pin‑count applications.
- Regulatory alignment: RoHS compliance for environmental and manufacturing requirements.
Why Choose 5SGXMA7K2F40I3LG?
The 5SGXMA7K2F40I3LG positions itself as a high‑capacity FPGA solution within the Stratix V GX family by combining hundreds of thousands of logic elements with tens of megabits of embedded RAM and nearly 700 I/Os in a compact BGA package. Its industrial temperature rating and defined core voltage range make it suitable for designs that demand both performance and environmental robustness.
This device is appropriate for engineering teams implementing complex digital systems that require integrated memory, high I/O counts, and a large programmable fabric—offering a scalable platform for prototyping and deployment where these attributes are primary requirements.
Request a quote or submit an inquiry for part number 5SGXMA7K2F40I3LG to obtain pricing, lead time, and availability information tailored to your project requirements.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018