5SGXMA7K2F40I3W

The 5SGXMA7K2F40I3W is a Stratix® V GX field-programmable gate array (FPGA) optimized for high-density, transceiver-capable designs. It combines a large logic fabric and substantial on-chip memory with a high I/O count in a 1517-BBGA FCBGA package.

Designed for industrial environments, this device targets applications that require extensive programmable logic, plentiful embedded memory, and broad I/O connectivity while operating across an industrial temperature range.

Key Features

• Core Logic  Approximately 622,000 logic elements for implementing complex digital functions and high-density designs.
• Logic Array Resources  Device-level logic resources suitable for large-scale FPGA integration.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, packet storage, and local data processing.
• I/O Density & Package  696 user I/Os in a 1517-BBGA (FCBGA) package; supplier package listed as 1517-FBGA (40×40). Surface-mount package supports compact board-level integration.
• Power  Core supply range specified at 820 mV to 880 mV.
• Operating Range  Industrial-grade device with an operating temperature range of –40°C to 100°C.
• Series Transceiver Capability  Part of the Stratix V GX family, which includes transceiver-enabled device options as described in the Stratix V device documentation.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control & Automation  Leverage the industrial temperature rating and large logic/memory resources to implement complex control algorithms and I/O-heavy system consolidation.
• High-Speed Communications  Use the Stratix V GX family’s transceiver-capable architecture and high I/O count for board-level communication and protocol processing systems.
• Signal Processing & Acceleration  Deploy the extensive logic fabric and embedded memory for FPGA-based signal processing, streaming buffers, and hardware acceleration tasks.
• Networking & Infrastructure  Employ the device’s large on-chip RAM and I/O density for packet buffering, routing logic, and multi-protocol implementations.

Unique Advantages

• High Logic Density: Approximately 622,000 logic elements enable consolidation of multiple functions onto a single device, reducing system complexity.
• Substantial On-Chip Memory: Approximately 51.2 Mbits of embedded memory cuts dependence on external RAM for many buffering and state-storage needs.
• Extensive I/O Count: 696 I/Os simplify board-level integration and reduce the need for additional interface chips.
• Industrial Temperature Capability: Rated from –40°C to 100°C for deployment in demanding environments.
• Compact FCBGA Packaging: 1517-BBGA FCBGA package (1517-FBGA supplier package) balances high pin count with a compact footprint for dense PCB layouts.
• Regulatory Compliance: RoHS compliance supports environmentally conscious product designs.

Why Choose 5SGXMA7K2F40I3W?

The 5SGXMA7K2F40I3W provides a combination of very high logic capacity, significant embedded memory, and a high I/O count in a single industrial-grade Stratix V GX FPGA. It is well suited for designs that require on-chip resources to minimize external components while supporting transceiver-capable system architectures described in the Stratix V device documentation.

For engineers and procurement teams building industrial and communications systems, this device offers a balance of performance, integration, and environmental rating to support scalable, long-lived designs.

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