5SGXMA7K2F40I3WN

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

Quantity 141 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7K2F40I3WN – Stratix® V GX Field Programmable Gate Array (FPGA), 622,000 logic elements, 1517-FBGA

The 5SGXMA7K2F40I3WN is a Stratix V GX FPGA in a 1517-FBGA (40×40) package designed for high-density, industrial-grade programmable logic applications. It integrates a large logic fabric with a substantial embedded memory pool and a high I/O count to address complex system designs that require programmable hardware acceleration and flexible interfacing.

With an industrial operating temperature range and low core-voltage operation, this device is targeted at demanding embedded, communications, and industrial control markets where thermal range, integration density, and broad I/O capability matter.

Key Features

  • Core Logic 622,000 logic elements and 234,720 logic array blocks (LABs) provide a large, flexible fabric for implementing complex digital designs.
  • Embedded Memory Approximately 51.2 Mbits of embedded memory for on-chip buffering, FIFOs, and scratchpad storage to support data-heavy algorithms.
  • I/O Capacity 696 user I/O pins to accommodate wide parallel interfaces, multiple high-speed links, and extensive peripheral connectivity.
  • Package and Mounting 1517-BBGA / 1517-FBGA (40×40) FCBGA package, surface-mount mounting for compact board-level integration.
  • Power Core voltage supply range from 820 mV to 880 mV for core power sequencing and system power budgeting.
  • Temperature and Grade Industrial grade device rated for operation from −40 °C to 100 °C to support harsh-environment deployments.
  • Compliance RoHS compliant to meet common environmental and regulatory requirements.

Typical Applications

  • High-density data processing Implement compute- and memory-intensive functions such as packet processing, custom accelerators, and signal aggregation using the large logic and embedded RAM resources.
  • Telecommunications and networking Use the high I/O count and Stratix V GX family capabilities for line cards, switching, and protocol offload tasks.
  • Industrial automation and control Deployable in industrial systems requiring wide temperature range operation and extensive I/O to interface with sensors, actuators, and control networks.
  • Prototyping and hardware emulation Leverage the dense logic fabric and large on-chip memory for SoC prototyping, algorithm verification, and hardware/software co-design.

Unique Advantages

  • High integration density: 622,000 logic elements and over 234,000 logic array blocks reduce the need for multiple devices, simplifying BOM and PCB routing.
  • Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM enables large on-chip buffers and reduces external memory dependence for many designs.
  • Extensive I/O connectivity: 696 user I/Os provide flexibility to support broad interface requirements without additional multiplexing hardware.
  • Industrial operating range: Rated from −40 °C to 100 °C for reliable operation in demanding thermal environments.
  • Low core-voltage operation: 820–880 mV core supply range assists system power planning and efficient power distribution on the board.
  • RoHS compliant: Meets standard environmental compliance expectations for modern electronic systems.

Why Choose 5SGXMA7K2F40I3WN?

The 5SGXMA7K2F40I3WN offers a balance of high logic density, significant embedded memory, and broad I/O in a compact 1517-FBGA package tailored for industrial applications. Its electrical and thermal ratings make it suitable for designs that require sustained operation across a wide temperature range while preserving board-level integration and power-efficiency considerations.

This Stratix V GX device is well suited for engineers and system designers building complex programmable hardware solutions—ranging from communications interfaces and data-path accelerators to industrial controllers—where on-chip resources and reliable operation are key selection criteria.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical support for the 5SGXMA7K2F40I3WN.

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