5SGXMA7K3F35C2LN

The 5SGXMA7K3F35C2LN is a Stratix V GX field-programmable gate array (FPGA) IC providing large programmable logic capacity and substantial embedded memory for complex digital designs. It combines 622,000 logic elements with approximately 51.2 Mbits of on-chip RAM and 432 user I/Os in a 1152-ball FCBGA package.

Targeted for applications that require high integration density and extensive I/O, this commercial-grade device operates at a core supply range of 820 mV to 880 mV and within a 0 °C to 85 °C operating temperature window.

Key Features

• Logic Capacity — 622,000 logic elements for implementing large-scale programmable logic and complex datapaths.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip storage for data-intensive functions.
• I/O Resources — 432 user I/Os to accommodate dense external interfacing and high-pin-count system integration.
• Package & Mounting — 1152-BBGA (FCBGA) package, supplier designation 1152-FBGA (35×35), surface-mount for compact board layouts.
• Power Supply — Core voltage range of 820 mV to 880 mV for the device core supply requirements.
• Operating Grade & Temperature — Commercial grade with specified operating temperature from 0 °C to 85 °C.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-density programmable logic systems — Implements complex state machines, datapaths, and control logic where large logic capacity and embedded RAM are required.
• High-bandwidth I/O aggregation — 432 I/Os enable aggregation and bridging of multiple external interfaces in space-constrained designs.
• Signal processing and buffering — Substantial on-chip RAM supports buffering, pipeline storage, and intermediate data processing.

Unique Advantages

• Large integrated logic and memory: 622,000 logic elements combined with ~51.2 Mbits of embedded RAM reduce the need for external memory and simplify board-level design.
• High I/O count: 432 I/Os provide flexibility for complex multi-interface systems and high-pin-count peripherals.
• Compact FCBGA packaging: 1152-ball FCBGA (35×35) enables high-density PCB implementations while maintaining surface-mount assembly compatibility.
• Commercial temperature grade: Specified operation from 0 °C to 85 °C for standard commercial deployments.
• RoHS compliance: Meets RoHS requirements for lead-free manufacturing processes.

Why Choose 5SGXMA7K3F35C2LN?

The 5SGXMA7K3F35C2LN delivers a balance of very large programmable logic capacity, substantial embedded memory, and extensive I/O in a single commercial-grade Stratix V GX FPGA. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 432 I/Os in a 1152-ball FCBGA package makes it well suited to compact, high-density designs that require significant on-chip resources.

For design teams needing scalability, robust on-chip resources, and compliance with RoHS, this Stratix V GX device provides a clear specification set that supports complex digital, signal-processing, and I/O-intensive applications.

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