5SGXMA7K3F35C3G

The 5SGXMA7K3F35C3G is a Stratix® V GX family FPGA in a 1152-ball FCBGA package designed for high-density programmable logic applications. It delivers large on-chip logic capacity, significant embedded memory, and a high I/O count suitable for complex system designs.

Documented in the Stratix V device datasheet for electrical and switching characteristics, this commercial-grade FPGA targets designs that require broad integration of logic and memory with controlled core voltage and commercial-temperature operation.

Key Features

• Core logic density — 622,000 logic elements for implementing large-scale custom logic and control functions.
• On-chip memory — Approximately 51.2 Mbits of embedded memory to support buffering, LUTs, and other memory-intensive functions.
• I/O capacity — 432 I/O pins to support wide parallel interfaces and multi-channel connectivity.
• Package — 1152-ball BGA (FCBGA) supplier device package (1152-FBGA, 35×35 mm) with surface-mount mounting for compact board integration.
• Supply voltage — Core voltage specified from 820 mV to 880 mV to match system power budgets and regulator designs.
• Commercial temperature grade — Rated for 0 °C to 85 °C operating temperature suitable for commercial applications.
• Standards compliance — RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density digital systems — Implement complex logic, state machines, and custom datapaths using the device's large logic-element capacity and on-chip memory.
• Prototyping and IP integration — Integrate and validate large IP blocks or system prototypes that require extensive programmable resources and numerous I/Os.
• Multi-channel interfacing — Support systems that need many parallel I/Os for sensors, peripherals, or board-level interfaces thanks to 432 available I/Os.

Unique Advantages

• Significant integration density: 622,000 logic elements reduce the need for multiple devices by consolidating complex logic into a single FPGA.
• Large embedded memory footprint: Approximately 51.2 Mbits of on-chip RAM provides substantial space for buffering, LUTs, and data handling without external memory.
• High I/O count: 432 I/Os enable broad connectivity and reduce system-level glue logic for multi-interface designs.
• Commercial operating range: Specified for 0 °C to 85 °C, aligning with standard commercial applications and deployments.
• Surface-mount FCBGA package: Compact 1152-ball package supports dense PCB layouts while preserving routing and thermal characteristics expected for high-pin-count FPGAs.
• Regulatory readiness: RoHS compliance supports modern manufacturing and procurement requirements.

Why Choose 5SGXMA7K3F35C3G?

The 5SGXMA7K3F35C3G combines large logic capacity, substantial embedded memory, and a high pin count in a commercial-grade Stratix V GX FPGA package. Its specification suite — including core voltage range, surface-mount 1152-BBGA package, and RoHS compliance — makes it a straightforward choice for engineers designing complex digital systems that require consolidated programmable logic and broad I/O.

This device is suitable for development teams and OEMs looking for a scalable, single-chip solution to reduce BOM complexity and accelerate time-to-market while operating within commercial temperature and power parameters. Reference the Stratix V device documentation for detailed electrical and switching characteristics for system integration.

Request a quote or submit a procurement inquiry to evaluate 5SGXMA7K3F35C3G for your next design and obtain pricing, availability, and lead-time information.