5SGXMA7K3F35C3WN

The 5SGXMA7K3F35C3WN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offering a high-density programmable fabric with 622,000 logic elements and approximately 51.2 Mbits of embedded RAM. The device provides 432 general-purpose I/O and is supplied in a 1152-BBGA FCBGA package (1152-FBGA, 35×35).

This commercial-grade, surface-mount FPGA operates from a core supply range of 820 mV to 880 mV and is rated for an ambient operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core density: 622,000 logic elements (cells) for complex digital designs and high logic integration.
• Embedded memory: Approximately 51.2 Mbits of on-chip RAM to support buffering, frame storage, and state machines.
• I/O capability: 432 I/O pins to accommodate wide parallel interfaces and multiple peripheral connections.
• Package: 1152-BBGA, FCBGA (supplier package: 1152-FBGA, 35×35) designed for compact, high-density board integration; surface-mount mounting type.
• Power supply: Core voltage range from 820 mV to 880 mV for core power planning and regulator selection.
• Operating conditions: Commercial temperature grade with a 0 °C to 85 °C operating range.
• Regulatory: RoHS compliant for lead-free manufacturing processes.

Unique Advantages

• High integration density: 622,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM provide local storage for large buffers and complex state retention without external memory.
• Broad I/O availability: 432 I/Os support extensive peripheral connectivity and parallel data paths for high-bandwidth interfaces.
• Compact BGA footprint: 1152-ball FCBGA (35×35) package delivers high pin count in a compact form factor suitable for dense PCB layouts.
• Commercial temperature rating: Designed for commercial applications with an operating range of 0 °C to 85 °C, matching many industrial, networking, and compute use cases that operate in conditioned environments.
• RoHS compliance: Facilitates adherence to environmental and manufacturing requirements for lead-free production.

Why Choose 5SGXMA7K3F35C3WN?

The 5SGXMA7K3F35C3WN combines a large logic fabric, significant embedded memory, and a high I/O count in a compact 1152-ball BGA package—making it well suited for designs that require dense logic, on-chip storage, and extensive board-level connectivity within commercial operating conditions. As a member of the Stratix V GX family from Intel, this device targets applications that need substantial programmable resources and integration in a surface-mount form factor.

For design teams focused on reducing system-level component count while maintaining flexibility and scalability, this device offers a balance of capacity, I/O, and package density backed by documented electrical and operating specifications.

Request a quote or submit an inquiry to obtain pricing, availability, and further ordering information for the 5SGXMA7K3F35C3WN.