5SGXMA7K3F35C3N

The 5SGXMA7K3F35C3N is a Stratix V GX family FPGA from Intel, delivered in a 1152-BBGA FCBGA package for surface-mount assembly. It provides a high-density programmable logic platform with a large on-chip memory complement and substantial I/O capacity for complex system designs.

Designed for commercial-grade applications, this device combines up to 622,000 logic elements with approximately 51.2 Mbits of embedded memory and 432 I/Os, offering a foundation for dense logic integration and rich peripheral interfacing while operating within a 0 °C to 85 °C temperature range and a core supply window of 0.820–0.880 V.

Key Features

• High Logic Density  622,000 logic elements support large-scale, complex logic implementations and deep custom datapaths.
• Significant Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to store large buffering, state, and lookup data close to logic for low-latency designs.
• Large I/O Complement  432 I/Os enable extensive external interfacing for multi-channel systems, parallel buses, and high pin-count peripherals.
• Package and Mounting  1152-BBGA (FCBGA) package—supplier package specified as 1152-FBGA (35×35)—designed for surface-mount board-level integration.
• Commercial Grade Operating Range  Rated for 0 °C to 85 °C ambient operation, matching commercial-class deployment requirements.
• Core Supply  Core voltage specified from 820 mV to 880 mV to align with platform power provisioning.
• Standards Compliance  RoHS-compliant material status for regulatory and environmental requirements.

Typical Applications

• High-density logic systems  Use the device's 622,000 logic elements and large embedded memory for complex state machines, signal processing pipelines, and algorithm acceleration implemented in programmable logic.
• Multi-I/O interface hubs  With 432 I/Os, the FPGA is suitable for designs requiring broad peripheral connectivity and parallel interfaces between sensors, controllers, and external logic.
• Prototype and system integration  Large logic and memory resources support board-level prototyping and integration of multiple functions into a single programmable device.

Unique Advantages

• Scalable logic capacity: 622,000 logic elements let designers consolidate functions that would otherwise require multiple devices, reducing board complexity.
• On-chip memory for performance: Approximately 51.2 Mbits of embedded RAM reduces external memory dependence and improves data-path latency.
• Broad external connectivity: 432 I/Os enable flexible interfacing options for complex multi-channel systems and parallel buses.
• Commercial temperature rating: 0 °C to 85 °C operational range aligns with many commercial application requirements while simplifying thermal planning.
• Industry-standard packaging: 1152-BBGA/1152-FBGA (35×35) footprint supports established board design flows for surface-mount assembly.
• Regulatory readiness: RoHS compliance helps meet environmental and supply-chain requirements.

Why Choose 5SGXMA7K3F35C3N?

The 5SGXMA7K3F35C3N combines very large logic resources, substantial embedded memory, and a high I/O count in a single commercial-grade Stratix V GX device and a 1152-BBGA package. This balance of density and interfacing capability is suited to designs that require consolidation of complex logic, extensive buffering, and flexible external connectivity while operating on a modest core supply range.

Backed by Intel's Stratix V family documentation and device-level electrical characteristics, this part is appropriate for engineering teams looking to implement high-density programmable designs with a clear set of verified electrical and thermal operating parameters.

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