5SGXMA7K3F35C3

The 5SGXMA7K3F35C3 is an Intel Stratix V GX field programmable gate array delivering high logic capacity and abundant on-chip memory in a surface-mount FCBGA package. It integrates 622,000 logic elements with approximately 51.2 Mbits of embedded RAM and 432 user I/Os, providing a platform for complex, high-density designs.

Offered as a commercial-grade device with an operating range of 0 °C to 85 °C and a core supply range of 820 mV to 880 mV, this device suits designs that require large programmable logic, significant embedded memory, and extensive I/O routing in a compact 1152-ball FBGA (35×35) footprint.

Key Features

• Logic Capacity — 622,000 logic elements to implement large-scale combinational and sequential logic networks.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and local storage.
• I/O Count — 432 general-purpose I/Os to support high channel counts and complex interfacing requirements.
• Package & Mounting — 1152-BBGA FCBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for dense board-level integration.
• Power — Core supply operating range from 820 mV to 880 mV to match system power-rail planning and sequencing.
• Temperature Grade — Commercial grade operation specified from 0 °C to 85 °C for standard commercial deployments.
• Standards Compliance — RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• High-density FPGA designs — Implement large logic functions and complex control algorithms using 622,000 logic elements and substantial embedded RAM.
• I/O-intensive systems — Support multi-channel interfaces, parallel sensors, or wide data buses with 432 user I/Os.
• Compact board-level integration — The 1152-ball FBGA (35×35) surface-mount package enables dense PCB layouts where board space is constrained.
• Commercial electronic products — Designed for systems operating in the commercial temperature range (0 °C to 85 °C) and requiring RoHS compliance.

Unique Advantages

• Substantial logic resource: 622,000 logic elements allow implementation of large, integrated digital functions without spreading designs across multiple devices.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces reliance on external memory for buffering and data paths.
• High I/O density: 432 I/Os provide flexibility for routing multiple interfaces, buses, and peripheral connections from a single FPGA.
• Compact, manufacturable package: 1152-BBGA (35×35) surface-mount packaging balances high pin count with practical PCB assembly considerations.
• Commercial temperature and RoHS compliant: Clear specification for commercial deployment and compliance with lead-free manufacturing requirements.
• Controlled core voltage range: Defined operating core supply (820–880 mV) assists in power budgeting and system sequencing.

Why Choose 5SGXMA7K3F35C3?

The 5SGXMA7K3F35C3 positions itself as a high-capacity Stratix V GX FPGA suitable for designs that demand large programmable logic arrays, substantial embedded RAM, and many I/Os within a compact BGA footprint. Its commercial-grade temperature range, RoHS compliance, and defined core voltage range make it a practical choice for commercial electronic products requiring robust on-chip resources and dense system integration.

Engineers and procurement teams seeking a single-device solution to consolidate complex logic, on-chip storage, and extensive interfacing will find this device offers predictable electrical characteristics and package options well suited to high-density board designs.

Request a quote or submit an inquiry today to learn about availability, lead times, and volume pricing for 5SGXMA7K3F35C3.