5SGXMA7K3F35C2G

The 5SGXMA7K3F35C2G is a Stratix® V GX field-programmable gate array (FPGA) supplied in a 1152-BBGA FCBGA package. It combines high logic density with a large pool of embedded RAM and a high I/O count, delivered in a commercial-temperature-grade device.

Designed for applications requiring significant on-chip logic and memory capacity, this device provides a platform for complex digital designs while operating within a defined core voltage range and standard commercial temperature window.

Key Features

• Core / Logic Capacity  622,000 logic elements (cells) enable implementation of large-scale custom logic and high-density designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support memory-intensive algorithms and buffering.
• I/O  432 general-purpose I/O pins provide broad connectivity for multi-channel interfaces and parallel buses.
• Package & Mounting  1152-BBGA (1152-FBGA, 35×35) FCBGA package, surface-mount mounting type, suitable for compact, high-pin-count PCB layouts.
• Power  Core voltage supply range of 870 mV to 930 mV for defined power-supply design and management.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Stratix V Family Documentation  Device electrical and switching characteristics are documented in the Stratix V device datasheet for design and validation reference.

Typical Applications

• High‑density digital logic  Implement complex state machines, custom datapaths, and large-scale combinational/sequential logic leveraging 622,000 logic elements.
• Memory‑intensive processing  Use the device’s ~51.2 Mbits of embedded RAM for buffering, look-up tables, and on-chip data storage for algorithms.
• High‑pin-count interfacing  Leverage 432 I/Os to bridge multiple peripherals, parallel buses, or multi-lane interfaces on a single device.

Unique Advantages

• High integration density: 622,000 logic elements reduce the need for multiple FPGAs or external glue logic in complex designs.
• Substantial on‑chip memory: Approximately 51.2 Mbits of embedded RAM supports data buffering and local storage, simplifying system memory architecture.
• Extensive I/O resources: 432 I/Os enable flexible connectivity and simultaneous interface implementations without external multiplexing.
• Compact, high‑pin package: 1152-BBGA (35×35) package delivers high pin density in a space-efficient footprint for advanced PCB designs.
• Defined operating window: Commercial grade with 0 °C to 85 °C operation and a specified core voltage range lets teams plan power and thermal strategies precisely.
• Documented device characteristics: Electrical and switching specifications for the Stratix V family are provided in the datasheet to support design validation.

Why Choose 5SGXMA7K3F35C2G?

The 5SGXMA7K3F35C2G positions itself as a high-density Stratix V GX FPGA option for designs that require substantial logic resources, on-chip RAM, and a large number of I/Os in a single package. Its commercial-grade operating range, defined core voltage window, and compact 1152-BBGA footprint make it suitable for demanding digital systems where integration and deterministic electrical parameters matter.

Engineers selecting this device gain access to the Stratix V family documentation for electrical and timing characteristics, enabling methodical system-level planning and validation for medium- to large-scale FPGA implementations.

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