5SGXMA7N1F40I2N

The 5SGXMA7N1F40I2N is a Stratix V GX Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA package designed for high-density programmable logic applications. It provides 622,000 logic elements, approximately 51.2 Mbits of embedded memory and up to 600 I/Os, delivering the capacity needed for complex logic, buffering and high‑I/O designs.

Targeted at industrial-grade systems, this device supports an extended operating range and a low-voltage core supply, offering a compact, surface-mount solution for designs that require large logic capacity and extensive on-chip memory.

Key Features

• Logic Capacity — 622,000 logic elements to implement large-scale digital designs and complex processing blocks.
• Embedded Memory — Approximately 51.2 Mbits of total on-chip RAM for buffers, FIFOs, and data-path storage.
• I/O — Up to 600 programmable I/Os to support dense external interfacing and wide bus architectures.
• Power Supply — Core voltage range of 870 mV to 930 mV for integration with low-voltage power domains.
• Package & Mounting — Surface-mount 1517-BBGA (supplier device package: 1517-FBGA, 40×40) for compact board footprint and high I/O density.
• Temperature & Grade — Industrial grade operation with an operating temperature range of −40 °C to 100 °C suitable for extended-temperature environments.
• Compliance — RoHS compliant to meet common environmental requirements.
• Stratix V GX Family Context — Part of the Stratix V GX family referenced in the device datasheet, which documents electrical characteristics and transceiver speed grade options for GX devices.

Typical Applications

• High-density FPGA systems — Implement large custom logic blocks, datapath engines and protocol processing where extensive logic and on-chip RAM are required.
• Multi‑I/O bridging and aggregation — Use the 600 I/Os to connect and route multiple parallel interfaces, buses or board-level subsystems.
• Memory‑intensive processing — On-chip RAM supports buffering, packet staging and temporary storage for throughput‑oriented designs.
• Industrial control and automation — Industrial temperature grade and robust package make the device suitable for control systems and equipment operating across wide temperature ranges.

Unique Advantages

• High integration density: 622,000 logic elements combined with ~51.2 Mbits of RAM reduces external component needs and consolidates system logic on a single device.
• Large I/O count: Up to 600 I/Os enable direct connection to multiple peripherals, sensors, and high‑pin-count interfaces without extensive glue logic.
• Industrial temperature capability: Rated for −40 °C to 100 °C, supporting deployment in extended‑temperature environments.
• Compact package: 1517-BBGA / 1517-FBGA (40×40) surface-mount packaging offers a small board footprint while preserving high I/O density.
• Low-voltage core support: Operates within a core supply range of 870 mV to 930 mV for compatibility with modern low-voltage power architectures.
• Standards‑aware design foundation: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXMA7N1F40I2N?

The 5SGXMA7N1F40I2N delivers a balanced combination of large logic capacity, substantial embedded memory and extensive I/O in a single industrial-grade FPGA package. Its specification set addresses designs that demand high integration density, broad interfacing capability and reliable operation across an extended temperature range.

This device is suitable for engineering teams building complex programmable systems that require scalable logic resources and on-chip RAM to reduce external components. As a member of the Stratix V GX family, it aligns with the documented electrical and switching characteristics for that device series.

Request a quote or submit an inquiry to obtain pricing, lead time and availability for 5SGXMA7N1F40I2N. Our team can provide the information you need to evaluate this FPGA for your design.