5SGXMA7N1F45C1N

The 5SGXMA7N1F45C1N is a Stratix® V GX field programmable gate array (FPGA) IC from Intel. It provides a high-density programmable-logic fabric combined with a large embedded memory capacity and a high I/O count for complex digital designs.

This device targets applications that require substantial logic resources, significant on-chip RAM, and extensive interfacing capability. The part is supplied in a 1932-BBGA FCBGA package and is offered in a commercial temperature grade.

Key Features

• Core Logic Capacity — 622,000 logic elements for implementing large-scale digital designs and multi-function hardware systems.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM (Total Ram Bits: 51,200,000) to support buffers, FIFOs, and memory-intensive algorithms.
• I/O Resources — 840 I/O pins to accommodate wide external connectivity and complex board-level integration.
• Programmable I/O Timing — Stratix V documentation describes programmable I/O element (IOE) delay and programmable output buffer delay for fine-grained I/O timing control.
• Power Supply — Core voltage supply range from 870 mV to 930 mV for the device core.
• Package & Mounting — 1932-BBGA (FCBGA) package, supplier device package listed as 1932-FBGA, FC (45×45); surface-mount mounting type.
• Temperature Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Programmable logic and hardware acceleration — Use the device’s large logic capacity and embedded memory to implement custom hardware accelerators and complex state machines.
• I/O‑intensive systems — 840 I/O pins allow broad external interfacing for multi‑lane and multi‑peripheral designs.
• Memory‑heavy designs — Approximately 51.2 Mbits of on-chip RAM supports buffering, data streaming, and local storage requirements.
• Board‑level, surface‑mount solutions — The 1932-BBGA FCBGA package suits high‑density PCB implementations where surface-mount assembly is required.

Unique Advantages

• High logic density: 622,000 logic elements provide the capacity to consolidate multiple functions into a single FPGA device.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces reliance on external memory for many buffering and data‑path tasks.
• Extensive I/O integration: 840 I/O pins simplify system integration and reduce the need for additional I/O expanders.
• Compact, industry-standard packaging: 1932-BBGA FCBGA (45×45) footprint supports high-density board designs while maintaining surface-mount assembly compatibility.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation for standard commercial deployments.
• Regulatory compliance: RoHS compliance supports environmental and supply-chain requirements.

Why Choose 5SGXMA7N1F45C1N?

The 5SGXMA7N1F45C1N combines a large programmable-logic fabric, significant embedded memory, and an extensive I/O complement in a high-density 1932-BBGA package. Its specifications make it well suited for complex digital implementations that require on-chip RAM and broad external interfacing while adhering to commercial temperature ranges and RoHS requirements.

Design teams seeking a Stratix V GX FPGA with clear, verifiable device characteristics and family-level documentation will find this part aligned with projects that demand high logic capacity, memory resources, and board-level integration density.

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