5SGXMA7N1F45C2G

The 5SGXMA7N1F45C2G is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) IC designed for high-density, high-I/O applications. Built on the Stratix V GX family architecture, this commercial-grade device delivers large logic capacity, substantial on-chip memory, and a high pin-count package for complex system integration.

Key value comes from the combination of 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and up to 840 I/O pins in a 1932-BBGA FCBGA package—enabling dense digital processing, wide parallel interfacing, and compact board-level implementations.

Key Features

• Core logic density  622,000 logic elements for implementing large FPGA designs and complex digital systems.
• Embedded memory  Approximately 51.2 Mbits of on-chip RAM to support large buffers, state machines, and memory-intensive logic functions.
• I/O capability  Up to 840 I/O pins to support wide parallel interfaces and dense external connectivity.
• Power  Core supply range specified at 870 mV to 930 mV, enabling low-voltage core operation.
• Package  1932-BBGA, FCBGA footprint; supplier device package listed as 1932-FBGA, FC (45×45) for high pin-count, compact board mounting.
• Mounting & temperature  Surface-mount device rated for commercial temperature operation from 0 °C to 85 °C.
• Commercial grade  Specified as a commercial-grade FPGA suitable for standard embedded and system applications.
• Stratix V GX family characteristics  Part of the Stratix V GX series described in the Stratix V device datasheet, which documents electrical and switching characteristics for the family.

Typical Applications

• High-density digital processing  Implement large-scale logic functions and custom compute pipelines using 622,000 logic elements and abundant on-chip RAM.
• Multi-channel interface and I/O aggregation  Support boards and systems requiring up to 840 I/Os in a single FPGA package for wide parallel data paths and dense connectivity.
• Communications and networking systems  Leverage the Stratix V GX family characteristics and high I/O density for packet processing, protocol bridging, and interface consolidation.
• Board-level integration in commercial products  Surface-mount 1932-BBGA packaging enables compact integration for mid- to high-volume commercial applications operating in the 0 °C to 85 °C range.

Unique Advantages

• Highly integrated logic and memory: The combination of 622,000 logic elements and ~51.2 Mbits of embedded RAM reduces the need for external memory and discrete logic, simplifying BOM and board layout.
• Very high I/O density: Up to 840 I/Os in a 1932-BBGA package enables complex routing and multiple parallel interfaces without multiple FPGAs.
• Compact, high-pin-count package: The 1932-BBGA / 1932-FBGA (45×45) package balances pin count with a compact footprint for space-constrained designs.
• Low-voltage core operation: Core supply specified between 870 mV and 930 mV supports efficient core power domains.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with typical commercial deployments and product lifecycles.

Why Choose 5SGXMA7N1F45C2G?

This Intel Stratix V GX FPGA offers a strong combination of logic capacity, embedded memory, and I/O count in a single commercial-grade device. It is suited to designs that require substantial on-chip resources and high pin density while retaining a compact package footprint.

Engineers and procurement teams looking to consolidate functions, reduce external components, and implement large-scale programmable logic in commercial products will find this part appropriate for scalable, robust designs backed by the Stratix V family documentation and electrical specifications.

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